2024 IEEE 74th Electronic Components and Technology Conference (ECTC) 2024
DOI: 10.1109/ectc51529.2024.00170
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A Novel DC-DC Converter Module Using the integrated Package Solution (iPaS) Substrate for Next Generation High Performance Computing (HPC) Applications

Shuhei Yamada,
Nobuyoshi Adachi,
Kazuki Itoyama
et al.
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