A novel copper electroplating formula for laser‐drilled micro via and through hole filling

Dow, Wei‐Ping; Chen, Hsiang-Hao

doi:10.1108/03056120410520597

Cited by 32 publications

(40 citation statements)

References 10 publications

(10 reference statements)

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“…[13][14][15] Results from these studies indicate that at least two plating additives are necessary for bottom-up copper filling of microvias. One additive is referred to as an accelerator; the other additive is a suppressor.…”

mentioning

confidence: 93%

Use of 3,3-Thiobis(1-propanesulfonate) to Accelerate Microvia Filling by Copper Electroplating

Chan

Chiu

Dow

et al. 2013

J. Electrochem. Soc.

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The most widely used accelerators for microvia filling by copper electroplating are 3-mercapto-1-propanesulfonate (MPS) and bis(3-sulfopropyl) disulfide (SPS). In this study, a new accelerator, 3,3-thiobis(1-propanesulfonate) (TBPS), which has neither a thiol group (e.g., MPS) nor a disulfide group (e.g., SPS) but rather contains a thioether group and two sulfonic acid groups, was investigated and formulated to perform microvia filling by copper electroplating. The accelerating effect of TBPS on copper electrodeposition and its chemical interaction with chloride ions and H 2 SO 4 were characterized by galvanostatic measurements. Electrochemical analyzes showed that the acceleration of TBPS on copper electrodeposition strongly depended on the chloride ion and H 2 SO 4 concentrations. An optimal copper plating solution composed of CuSO 4 , polyethylene glycol (PEG), TBPS, chloride ions, and H 2 SO 4 was developed and used to perform bottom-up copper filling of microvias. Although TBPS contains a thioether group instead of a thiol group, a trace amount of TBPS can strongly accelerate copper electrodeposition in the presence of proper chloride ion and H 2 SO 4 concentrations.

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confidence: 93%

Use of 3,3-Thiobis(1-propanesulfonate) to Accelerate Microvia Filling by Copper Electroplating

Chan

Chiu

Dow

et al. 2013

J. Electrochem. Soc.

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“…12,13 However, sometimes no electroplating has occurred in the holes because of the formation of air bubbles within via-holes. 14 In addition, one disadvantage of electroplating is the long process time. Therefore, we fabricated the via-hole interconnections, excluding the electroplating process, to save time and cost and to reduce noncontact by voids within the via-holes.…”

mentioning

confidence: 99%

Low-Temperature Silicon Wafer-Scale Thermocompression Bonding Using Electroplated Gold Layers in Hermetic Packaging

Park

Kim

Paek

et al. 2005

Electrochem. Solid-State Lett.

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We describe a low-temperature wafer-scale thermocompression bonding using electroplated gold layers. Silicon wafers were completely bonded at 320°C at a pressure of 2.5 MPa. The interconnection between the packaged devices and external terminal did not need metal filling and was made by gold films deposited on the sidewall of the via-hole. Helium leak rate was measured for application of thermocompression bonding to hermetic packaging and was 2.74 ± 0.61 ϫ 10 −11 Pa m 3 /s. Therefore, Au thermocompression bonding can be applied to high quality hermetic wafer level packaging of radio-frequency microelectromechanical system devices.

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“…In the present study, we used a plating solution with conventionally used copper sulfate and sulfuric acid [14,15] and the concentration of the additives was fixed at 5-20 ppm (Table 2) [20]. We compared the morphology of copper deposited on fibers when the additives were used separately and when none of the additives were used.…”

Section: Effect Of Additivesmentioning

confidence: 99%

“…However, in this research, Pd plating was used to achieve a basic adhesive strength by creating a seed layer on the clean fiber at the first stage of plating [10][11][12][13]. Subsequently, various organic additives were added to the seeded layer to control deposition of metal from metal ions to obtain a layer with the required fine structure [14,15].…”

Section: Introductionmentioning

confidence: 99%

Electrochemical Deposition of Copper on Polymer Fibers

Lim

Kim

Park

et al. 2016

Journal of Electrochemical Science and Technology

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In this study, we report the fabrication of functional complex fibers, which have been studied widely globally for numerous applications. Here, we fabricated conductive complex fibers with antibacterial properties by coating metal ions on the surface of plastic (polypropylene) fibers using the electroless and electrochemical deposition. First, we polished the polypropylene melt-blown fiber surface and obtained an absorbing Pd seed layer on its surface. Subsequently, we substituted the Pd with Cu. Bis-3-sulfopropyl-disulfide disodium salt (SPS), polyethylene glycol (PEG), and ethylene thiourea (ETU) were used as the brightener, carrier, and leveler, respectively for the electroplating. We focused on most achieving the stable plating condition to remove dendrites, which are normally during electroplating metals so that smooth layer is formed on the fiber surface. The higher the amount of SPS, the higher was the extent of irregular plate-like growth. Many irregularities in the form of round spheres were observed with increase in the amount of PEG and ETU. Hence, when the additives were used separately, a uniform coating could not be obtained. A stable coating was obtained when the three additives were combined and a uniform 5-9 µm thick copper layer with a stable morphology could be obtained around the fiber.We believe that our results can be applied widely to obtain conductive fibers with antibacterial properties and are useful in aiding research on conductive lightweight composite fibers for application in information technology and robotics.

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A novel copper electroplating formula for laser‐drilled micro via and through hole filling

Cited by 32 publications

References 10 publications

Use of 3,3-Thiobis(1-propanesulfonate) to Accelerate Microvia Filling by Copper Electroplating

Use of 3,3-Thiobis(1-propanesulfonate) to Accelerate Microvia Filling by Copper Electroplating

Low-Temperature Silicon Wafer-Scale Thermocompression Bonding Using Electroplated Gold Layers in Hermetic Packaging

Electrochemical Deposition of Copper on Polymer Fibers

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