A Novel Contactless SiC Wafer Planarization Processing after Mechanical Slicing by Dynamic Thermal Annealing Processes
Kohei Toda,
Daichi Kakutani,
Daichi Dojima
et al.
Abstract:In conventional machining of SiC wafers, material loss and sub-surface damage (SSD) of both the front and back surfaces are major issues. In this study, we focused on Dynamic AGE-ing® (DA), which is a sublimation-controlled process, and applied it to the total wafering process without any mechanical contact of both the front and back surfaces to explore the possibilities to reach the CMP-equivalent quality. DA process enables material lossless planarization of SiC wafers by applying a temperature gradient to a… Show more
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