A novel concept to enhance the applicability of solid gallium as phase change material for heat sinks by integrating within it discretely distributed chunks of un-encapsulated PCM

Enhancement of Gallium Phase-Change Heat Transfer by Copper Foam and Ultrasonic Vibration

“…Fan et al (2016) found that low-melting-point metals were suitable for thermal management of electronic devices when the quality requirements of heat sinks were less than the volume requirements. Al Omari et al (2018) embedded discrete cavities filled with an unencapsulated PCM within a solid gallium block for electronic cooling. Ge and Liu (2013) found that 3.4125 ml of gallium could remain below 45°C for 16 mins at 2.832 W and was expected to be used in smartphones and personal computers.…”