2022
DOI: 10.3390/mi13010135
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A Novel Bidirectional AlGaN/GaN ESD Protection Diode

Abstract: Despite the superior working properties, GaN-based HEMTs and systems are still confronted with the threat of a transient ESD event, especially for the vulnerable gate structure of the p-GaN or MOS HEMTs. Therefore, there is still an urgent need for a bidirectional ESD protection diode to improve the ESD robustness of a GaN power system. In this study, an AlGaN/GaN ESD protection diode with bidirectional clamp capability was proposed and investigated. Through the combination of two floating gate electrodes and … Show more

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Cited by 6 publications
(6 citation statements)
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References 17 publications
(18 reference statements)
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“…All the proposed B-TVS-D possess a high I S over than 8 A. Correspondingly, the equivalent HBM failure voltage (V HBM = I S × 1500 Ω) of the proposed B-TVS-D reaches to 12 kV; the value is higher than that of the bidirectional TVS diode in our previous work [19]. For the bidirectional AlGaN/GaN TVS diode in our previous work, both its V trig and I S are dependent on its capacitor.…”
Section: Resultsmentioning
confidence: 65%
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“…All the proposed B-TVS-D possess a high I S over than 8 A. Correspondingly, the equivalent HBM failure voltage (V HBM = I S × 1500 Ω) of the proposed B-TVS-D reaches to 12 kV; the value is higher than that of the bidirectional TVS diode in our previous work [19]. For the bidirectional AlGaN/GaN TVS diode in our previous work, both its V trig and I S are dependent on its capacitor.…”
Section: Resultsmentioning
confidence: 65%
“…It is obvious that the unidirectional TVS diode can be fabricated on the conventional p-GaN HEMT platform. TVS diode with the capability of bidirectional transient voltage suppression is needed [19]. To achieve this goal, we have proposed a bidirectional AlGaN/GaN TVS diode, which possesses a symmetrical triggering voltage (Vtrig) and a high secondary breakdown current (Is) in different directional electrostatic discharge events [19].…”
Section: Methodsmentioning
confidence: 99%
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“…Based on the above reasons, we carried out the experimental investigation and model analysis on the GaN ESD clamp. Similar to our previous work [18][19], for reducing the experimental cost, the equivalent structure made up of the chip resistor and p-GaN HEMTs (EPC2036) [20] is employed to carry out the experimental investigation. As noted, due to the lack of commercial GaN L-FER, L-FER in GaN ESD clamp is also made up of commercial p-GaN HEMT (EPC2036).…”
Section: Structure and Mechanismmentioning
confidence: 99%