A novel application of anodic bonding for electrical interconnect and its parameter characterization

Fan, Xuejiao; Zhang, Dacheng

doi:10.1109/icsict.2008.4735059

2008 9th International Conference on Solid-State and Integrated-Circuit Technology 2008

DOI: 10.1109/icsict.2008.4735059

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A novel application of anodic bonding for electrical interconnect and its parameter characterization

Xuejiao Fan

Dacheng Zhang

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A novel application of anodic bonding for electrical interconnect and its parameter characterization

Cited by 1 publication

References 6 publications

Discussion and analysis of Au/a-Si contact resistance in MEMS/NEMS devices

Discussion and analysis of Au/a-Si contact resistance in MEMS/NEMS devices

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