A novel antioxidant and low-temperature Sn-Zn solder paste based on Zn@Sn core-shell structure

WANG, Fengyi; WANG, Xinjie; Lv, Ziwen; Hang, Chunjin; Chen, Hongtao; LI, Mingyu

doi:10.1016/j.mtcomm.2022.103356

Cited by 9 publications

(4 citation statements)

References 23 publications

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“…Even with the low cooling rate (0.083 °C/s) utilized for heating and cooling in the DSC, there are some differences in the transition temperatures compared to the equilibrium diagram produced by the Thermo-Calc. Furthermore, the endothermic and exothermic peak positions are not entirely symmetrical because subcooling of the particles during the solidification process may cause them to shift …”

Section: Resultsmentioning

confidence: 99%

“…Furthermore, the endothermic and exothermic peak positions are not entirely symmetrical because subcooling of the particles during the solidification process may cause them to shift. 25 Figure 5 shows the differential scanning calorimetry results of the Sn−Ni−Zn alloys. The endothermic curves displayed the temperatures of 225.7 and 231, and 225.6 and 231.2 °C, for the Sn-0.2 wt % Ni-0.2 wt % Zn and Sn-0.2 wt % Ni-0.5 wt % Zn solder alloys, respectively.…”

Section: Resultsmentioning

confidence: 99%

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Role of Zn in the Microstructure, Segregation, and Cytotoxicity of Sn-0.2 Ni Solders

Paixão,

Batista de Sousa,

Dantas de Freitas

et al. 2024

ACS Omega

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Sn−Ni system alloys are promising alternatives to replace Sn−Pb alloys as they exhibit high corrosion resistance and good weldability. However, Sn−Ni alloys still have low mechanical strength and low reliability. Using the strategy of the addition of alloying elements can be a way to improve the properties of Sn−Ni alloys. Zinc (Zn) plays an essential role in the lead-free solder alloys sector by mitigating the growth of intermetallic compounds in soldered joints, refining the microstructure, enhancing the mechanical strength, and ultimately reducing the overall cost. This study aims to explore the impacts of Zn additions (0.2 and 0.5 wt %) on thermal parameters (growth rate-V and cooling rate-T ̇), macrostructure, microstructure, phase transformation, macrosegregation, and cytotoxicity. All of these factors will be examined in directionally solidified Sn-0.2 wt % Ni alloys under transient heat flow conditions on a copper sheet. The samples underwent characterization using optical microscopy, scanning electron microscopy, X-ray fluorescence, and X-ray diffraction. Property diagrams and isopleths were generated by using the CALPHAD method. Cytotoxicity analysis involved assessing cell viability after 15 and 30 days of incubation for the alloys, followed by exposure of the extracts for 24 and 48 h. The Zn additions caused a significant increase in the melting temperature in the Sn−Ni−Zn alloys. Fully columnar macrostructures were observed for the Sn−Ni−Zn alloys. The as-cast microstructures of Sn−Ni−Zn alloys were completely dendritic, with an Sn-rich matrix (Sn-β) surrounded by a Ni 3 Sn 4 + NiSn + Sn-β phase eutectic mixture. Zn additions did not change the dendritic arrangement of the Sn−Ni−Zn alloys when compared to the Sn-0.2 wt % Ni. Furthermore, increasing the Zn content did not affect the microstructural scale in the ternary Sn−Ni−Zn alloys. The toxicity of the examined alloys is not significantly influenced by the microstructural length scale. On the other hand, factors such as incubation time and chemical composition may have an impact on the cytotoxicity. Overall, the presence of Zn in the Sn−Ni−Zn alloys enhanced the cell viability.

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Section: Resultsmentioning

confidence: 99%

Section: Resultsmentioning

confidence: 99%

Role of Zn in the Microstructure, Segregation, and Cytotoxicity of Sn-0.2 Ni Solders

Paixão,

Batista de Sousa,

Dantas de Freitas

et al. 2024

ACS Omega

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“…To harness the endless possibilities of such third-generation electronics, there is a pressing need for advanced packaging materials capable of withstanding demanding operational conditions, including elevated temperatures resulting from increased power density and component miniaturization. Transient Liquid Phase (TLP) bonding is one potential approach for creating reliable interconnections [3]. The introduction of a lower melting point metal interlayer allows bonding via diffusion processes and the creation of intermetallic compounds (IMCs) with higher melting points.…”

Section: Introductionmentioning

confidence: 99%

BME-Assisted Fabrication of Porous Copper Films with Adjustable Porosity and Ligament Width for Microelectronic Interconnects

Wang,

Jiang,

Liu

et al. 2024

J. Phys.: Conf. Ser.

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Monolithic porous Cu films are synthesized through the use of bicontinuous microemulsion (BME) to serve as a flexible template. The BME system is made up of a series of interconnected linked water and hydrocarbon phases. This one-of-a-kind structure enables precision Cu electrodeposition only in the aqueous phase, avoiding undesirable electrodeposition in the oil phase. We can fine-tune the porosity and ligament width of the resultant copper film by altering the oil phase proportion in the soft template. This Sn-plated porous Cu is capable of both low-temperature reflow and high-temperature service. The flexible template approach shows great potential for creating porous Cu with changeable porosity, allowing for more control over compositions. This approach has potential applications in advanced packaging technologies.

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“…Thorough stirring is required before use if the paste brazing material shows signs of stratification. The performance of the brazing material significantly influence the quality of the brazed joint [10][11][12][13] . In this study, Al-Si-Cu-Ni low melting point brazing materials were prepared into material powders with suitable particle size using nitrogen atomization technology.…”

mentioning

confidence: 99%

Study on microstructure and mechanical properties of 3003 aluminum alloy joints brazed with Al–Si–Cu–Ni paste brazing materials

Gao,

Jin,

et al. 2024

Sci Rep

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Paste-type brazing materials have advantages such as adjusting the complexity of the parts to be soldered, easy storage and production in certain quantities. They can be used for brazing heat exchangers, liquid tanks and corrosion resistant parts. In this work, the microstructures and thermal behaviors of Al–Si–Cu–Ni brazing materials with different contents were investigated, and the effect of brazing process on the microstructural evolution and mechanical properties of brazed joints produced under nitrogen-filled environment was examined. It was found that the melting temperature of brazing material Al–5Si–20.5Cu–2Ni were ranged from 512.86 to 549.37 °C. The microstructure of Al–5Si–20.5Cu–2Ni consisted of α-Al solid solution, CuAl2 intermetallic compounds, the Al–Si–Cu phase, and some fine irregular Si particles in a homogenous manner. The microstructure of the brazed joints was uniformly formed during the brazing condition of 580 °C for 20 min, and the shear strength of the joints reached 41.76 MPa.

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A novel antioxidant and low-temperature Sn-Zn solder paste based on Zn@Sn core-shell structure

Cited by 9 publications

References 23 publications

Role of Zn in the Microstructure, Segregation, and Cytotoxicity of Sn-0.2 Ni Solders

Role of Zn in the Microstructure, Segregation, and Cytotoxicity of Sn-0.2 Ni Solders

BME-Assisted Fabrication of Porous Copper Films with Adjustable Porosity and Ligament Width for Microelectronic Interconnects

Study on microstructure and mechanical properties of 3003 aluminum alloy joints brazed with Al–Si–Cu–Ni paste brazing materials

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