A note on using VOF method for polymer bead manufacturing

Thirumalaikumaran, S. K.; Mithran, N.; Suwathy, R.; Venkatesan, M.

doi:10.1007/s12588-018-9209-8

Cited by 2 publications

(1 citation statement)

References 9 publications

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“…Therefore the liquid property in numerical simulation is defined as laminar flow. The upper wall-up of the simulation area is •8• defined as the pressure outlet, and the left, right, and lower walls are defined as the wall surface [51]. VOF method is used to simulate multiphase flow, Geo-Reconstruct scheme is used to calculate phase volume fraction, and the pressure dispersion solution uses PRESTO!, using the Standard model of Realizable k-ε turbulence model.…”

Section: Numerical Simulation Parameter Settingmentioning

confidence: 99%

Research on Surface Modification of Screen Printing Electronics

Tian

Yuan³

et al. 2021

Preprint

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Printing electronic components by screen printing with its excellent printing quality, high efficiency, and green environmental protection have broad application prospects in additive manufacturing. However, efficiency and quality of printing were decreased as conductive-ink blocking screen in the actual process of printing. Thus, it is pivotal that exploring factors of adhesion from the interaction of conductive-ink and screen. Herein, the functional relationship between adhesion and factors of adhesion and influence trend of adhesion on ink residue was obtained via the establishment of liquid-bridge adhesion model between two plates according to screen printing ink transfer process, solid-liquid wetting theory, and adhesion mechanism, which was verified by software Fluent. In order to justify the accuracy of the model and simulation, the adhesion and ink residue were tested on the surface-modified glass sheet as the result that the model and simulation were consistent with the experimental record. It was demonstrated that solid-liquid contact angle, tensile distance, and liquid volume are the main factors affecting the change of solid-liquid adhesion. With the increase of tensile distance and contact angle, the adhesion force decreases, which causes the decline of the residual amount of liquid on the solid surface. By means of screen modification, the adhesion between conductive-ink and screen can be reduced, as meanwhile the efficiency and quality of printed products can be improved.

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Section: Numerical Simulation Parameter Settingmentioning

confidence: 99%

Research on Surface Modification of Screen Printing Electronics

Tian

Yuan³

et al. 2021

Preprint

View full text Add to dashboard Cite

show abstract

Study on Influence of Adhesion Properties in Screen Printing Electronic Ink Transfer

Tian

Yuan

Zhao

et al. 2022

Shock and Vibration

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Printing electronic components by screen printing with the excellent printing quality, high efficiency, and environmental protection has broad application prospects in additive manufacturing. However, because conductive-ink blocks the screen, printing efficiency and quality decreased in the printing process. Thus, it is pivotal to explore adhesion factors from the interaction of conductive ink and screen. Herein, according to the transfer process of screen printing ink, solid-liquid wetting theory, and adhesion mechanism, we establish a liquid bridge adhesion model between two plates and obtain the functional relationship between the adhesion force and its influencing factors. Fluent software verifies the adhesion force model's conclusion to get the influence trend of the adhesion force on the ink residue. At last, by establishing a liquid bridge tensile fracture test, we gain experimental results consistent with the theoretical model and numerical simulation results. It is demonstrated that solid-liquid contact angle, tensile distance, and liquid volume are the main factors affecting the change of solid-liquid adhesion. The increase of tensile distance and contact angle will affect the adhesion force. The smaller the maximum solid-liquid adhesion during the initial stretching of the liquid bridge, the less the residual amount remained on the solid surface. By means of screen modification, the adhesion between conductive ink and screen can be reduced; meanwhile, the efficiency and quality of printed products can be improved. What's more, it also provides a valuable reference for the modification of screen printing electronics.

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A note on using VOF method for polymer bead manufacturing

Cited by 2 publications

References 9 publications

Research on Surface Modification of Screen Printing Electronics

Research on Surface Modification of Screen Printing Electronics

Study on Influence of Adhesion Properties in Screen Printing Electronic Ink Transfer

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