Abstract:A nitriding process of very thin molybdenum films in an expanding microwave plasma at low temperature Abstract. A transfer of nitrogen of about 20 at % is detected in very thin molybdenum films of about 200 nm thick coated on Si (100) wafers heated at 673 K and exposed to ternary (Ar-N 2 -H 2 ) plasma. The nitrogen diffusion goes with a noticeable decrease of the remaining oxide layers in the whole film thickness. On the contrary, pure N 2 gas exposure leads to a slight diffusion of nitrogen into the first mol… Show more
Nitridation of sapphire to form epitaxial AlN by microwave plasma containing nitrogen gas has been investigated to be an efficient process. Structural characterization with chemical analysis by X-ray diffraction and X-ray photoelectron spectroscopy shows that an epitaxial AlN film containing oxygen can form on sapphire by using pure nitrogen plasma. Furthermore, nitridation with N2/H2 plasma not only improves the crystallinity of the epitaxial AlN film without oxygen, but also significantly increases the nitridation rate to 9 nm min−1, resulting in 270 nm thick AlN for 30 min plasma nitriding.
Nitridation of sapphire to form epitaxial AlN by microwave plasma containing nitrogen gas has been investigated to be an efficient process. Structural characterization with chemical analysis by X-ray diffraction and X-ray photoelectron spectroscopy shows that an epitaxial AlN film containing oxygen can form on sapphire by using pure nitrogen plasma. Furthermore, nitridation with N2/H2 plasma not only improves the crystallinity of the epitaxial AlN film without oxygen, but also significantly increases the nitridation rate to 9 nm min−1, resulting in 270 nm thick AlN for 30 min plasma nitriding.
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