2022
DOI: 10.3390/ma15051659
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A New Wood Adhesive Based on Recycling Camellia oleifera Cake-Protein: Preparation and Properties

Abstract: In order to improve the initial viscosity and stability of Camellia oleifera cake-protein adhesive, Camellia oleifera cake-protein was blended with defatted soybean protein (DSP), soybean protein isolate (SPI), and casein, followed by adhesive preparation through degradation and crosslinking methods. The performance of Camellia oleifera cake-protein adhesive was investigated by Fourier transform infrared spectroscopy (FT-IR), differential scanning calorimetry (DSC), scanning electron microscopic (SEM), and the… Show more

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Cited by 5 publications
(4 citation statements)
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“…The insoluble substance content was below 6% under both independent addition of tannin and sucrose, but when the tannin-sucrose mass ratio was 80:20 to 20:80, the insoluble substance content ranged from 62.4% to 76.9%. The insoluble substance content in the curing products of the tannin-sucrose composite adhesives significantly increased, proving the crosslinking reaction of tannin and sucrose [36]. Under the different mass ratios, the crosslinking degree and intensity of the cured adhesives were varied.…”
Section: The Effect Of Mass Ratio Of the Tannin To Sucrose On The Per...mentioning
confidence: 96%
See 1 more Smart Citation
“…The insoluble substance content was below 6% under both independent addition of tannin and sucrose, but when the tannin-sucrose mass ratio was 80:20 to 20:80, the insoluble substance content ranged from 62.4% to 76.9%. The insoluble substance content in the curing products of the tannin-sucrose composite adhesives significantly increased, proving the crosslinking reaction of tannin and sucrose [36]. Under the different mass ratios, the crosslinking degree and intensity of the cured adhesives were varied.…”
Section: The Effect Of Mass Ratio Of the Tannin To Sucrose On The Per...mentioning
confidence: 96%
“…The adhesives were placed in tin foil and dried in a thermostatic ventilation oven at 60~70 • C [36]. Then, the adhesive was taken out, ground and passed through a 200-mesh sieve to obtain the adhesive powders (also used to test the curing performance of the tannin-sucrose composite adhesives).…”
Section: Insoluble Substances Rate In Cured Adhesivesmentioning
confidence: 99%
“…Similarly, a new crystallization peak was formed, and the crystallinity also increased after adding SPI, manifesting that the cross-linking degree increased, and the crystallinity was further improved by increasing the substitution ratio and curing temperature. However, the crystallinity at 33.3 • decreased somehow when the curing temperature was raised to 220 • C, because although high temperature was helpful to further improve the conversion of furanic compounds, the cross-linking degree and density of tannin and SPI were too high, which would reduce the crystallinity on the contrary [30,31,40]. In addition, the crystallinity of cross-linked products would also be reduced due to their decomposition at high curing temperature.…”
Section: Crystallization Property Analysis Of Cured Adhesivementioning
confidence: 99%
“…For the tannin-sucrose-SPI adhesive, long-chain SPI molecules were interspersed into the system to improve the overall flexibility of the adhesive, and the cross-linking structure and cross-linking density were further enhanced. The bonding layer of cured adhesive formed a dense and compact structure, and meanwhile, there was a better elastic contact and regular arrangement in the cured adhesive, which was more conducive to waterproof and the water resistance of the adhesive [7,36,40,46]. Due to the toughening effect of long-chain SPI, the over cross-linking of the tannin-sucrose adhesive system and the brittleness increase induced by water evaporation during hot pressing were relieved, and the degradation of bonding performance was avoided [47][48][49], macroscopically presenting good bonding strength and durability.…”
Section: Bonding Mechanism Analysis Of the Tannin-sucrose-spi Adhesivementioning
confidence: 99%