A New Wafer Prealigner

Fu, Zhuang; Huang, Cheng; Liu, R. Q.; Chen, Z. P.; Zhao, Yan; Cao, Qixin

doi:10.1007/978-3-540-73374-4_59

Cited by 2 publications

(2 citation statements)

References 2 publications

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“…The method for calculating the shape center of wafer is called the least minimum square method. However, because the roundness tolerance of the 10-inch wafer is^0.1 mm, and also the data of positioning notch needs processing individually, the taken method is not the least minimum square one, but a way based on the mass center (Song et al, 2006;Ziger, 2002;Beaulieu, 1987;Fu et al, 2007). As shown in Figure 4, the data acquisition card synchronously collects the digital signals from the reflection-style laser sensor trigged by the pulse of the rotated table encoder.…”

Section: The Prealigning Algorithmmentioning

confidence: 99%

“…The method for calculating the shape center of wafer is called the least minimum square method. However, because the roundness tolerance of the 10‐inch wafer is ±0.1 mm, and also the data of positioning notch needs processing individually, the taken method is not the least minimum square one, but a way based on the mass center (Song et al , 2006; Ziger, 2002; Beaulieu, 1987; Fu et al , 2007).…”

Section: The Prealigning Algorithmmentioning

confidence: 99%

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Wafer prealigning robot based on shape center calculation

Huang

Liu

et al. 2008

Industrial Robot: An International Journal

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Purpose-The aim of this paper is to provide a new wafer prealigning robot for the photo-etching facility during the manufacturing of IC products. Design/methodology/approach-The shape center is measured by a reflection-style laser sensor in the wafer's radial direction, and the position is measured by a penetration-style laser sensor. A dynamic error compensation is applied to eliminate the radial runout and wobble of the rotary stage, which have effects on the measurement of the wafer's shape center. Findings-It is found that the new wafer prealigning robot can satisfy the accuracy requirement. Research limitations/implications-The robot requires that the shape center can be accurately calculated. Practical implications-The robot is applicable to wafer prealigning for the photo-etching facility. Originality/value-A wafer prealigning robot based on the shape center calculation method has been developed and is described in the paper.

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Section: The Prealigning Algorithmmentioning

confidence: 99%