A new surface-alloying technique for pure copper

Abstract

A totally new technique of surface modification-thermal surface-alloying treatment for pure copper-was developed. A 0.2-1.8 mm copper alloy layer, which has a hardness 4 to 5 times higher than the pure copper substrate, was formed after the treatment. The significance of this technique is that the surface of pure copper can be efficiently hardened without significant reduction of the overall thermal and electrical conductivity. Variations of composition and microstructure in the alloy layer were studied after pure copper was surface alloy treated with aluminum.FIG. 1. Schematic relationship between ID, Do, and D.