2016
DOI: 10.1177/0954008315626806
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A new resin with improved processability and thermal stability

Abstract: To maintain outstanding thermal stability, amino-and hydroxyl-containing phthalonitrile monomers, 4-(4-aminophenoxy)-phthalonitrile (APN) and 4-(4-hydroxyphenoxy)-phthalonitrile (HPN) were selected and synthesized. Their structures were confirmed by proton nuclear magnetic resonance spectroscopy. Their curing polymers were characterized by Fourier transform infrared spectroscopy. The self-catalytic curing behaviors of the monomers were investigated by differential scanning calorimetry (DSC) at different heatin… Show more

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Cited by 11 publications
(5 citation statements)
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References 28 publications
(34 reference statements)
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“…The mixture was transferred into an aluminum mold, degassed under vacuum at 200°C for 40 min, and then postcured with diverse curing procedures in a muffle furnace. 33 As a result, BDSP polymers were prepared and processed into normative specimens for testing.…”
Section: Methodsmentioning
confidence: 99%
“…The mixture was transferred into an aluminum mold, degassed under vacuum at 200°C for 40 min, and then postcured with diverse curing procedures in a muffle furnace. 33 As a result, BDSP polymers were prepared and processed into normative specimens for testing.…”
Section: Methodsmentioning
confidence: 99%
“…Next, brown and transparent PCBDCy was obtained (yield: 64.17%), which was prepared in an 80% acetone solution for later use. In the spectrum of IMP 1, protons on benzene rings appeared in the range of 7.51-7.26 ppm (H 1 -H 3 ), and alkene protons were observed at 6.80-6.75 ppm (H 4 ) and 6.26-6.19 ppm (H 5 ), respectively [19,20]. Peaks observed at 5.13-5.12 ppm were attributed to acetal protons (H 6 ).…”
Section: Synthesis Of Pcbdcymentioning
confidence: 99%
“…For example, high-temperature resistant resins are used as coatings, 6 adhesives 7,8 and matrix components 9 to protect aircraft fuselage against thermal shock caused by atmospheric friction, and to ensure long-term and stable operation of engines and electronic equipment at high-temperature. Among thermosetting polymeric materials, polyimide, 10–12 bismaleimide, 13–15 phthalonitrile 16,17 and silicone resins have become important paragons in the field of high-temperature resistance due to their excellent thermal stability. Since the bond energy of the Si–O bond (460.5 kJ mol −1 ) is much higher than that of the C–C (304.0 kJ mol −1 ) and C–O (358.0 kJ mol −1 ) bonds, silicone resins show improved thermal stability compared to other resins mentioned above with C–C and C–O bonds as the framework.…”
Section: Introductionmentioning
confidence: 99%