Abstract:Alternative approaches to the interconnection problem on multilayer boards are studied and evaluated with respect to their desirability and feasability.A brief review of the current methodology is included to hiahliaht those aspects of the current approach that miaht be improved upon. The conclusion is that a more intearated approach to interconnection on multilayer boards is essential to deriving the maximum benefit from the additional degrees of freedom afforded by a multilayer board.Various such integrated … Show more
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