A new multilevel interconnection system for submicrometer VLSI's using multilayered dielectrics of plasma Silicon Oxide and low-thermal-expansion polyimide

Misawa, Yutaka; Kinjo, Noriyuki; Hirao, M.; Numata, Shinichi; Momma, N.

doi:10.1109/t-ed.1987.22972

Cited by 21 publications

(6 citation statements)

References 9 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…[77] is in mL/g, and the weight average molecular weight is obtained by light scattering. Equation 8reported by Miwa and Numata predicts values for [77] that are only about one-half those expected from eqs 7 for a given M.…”

Section: Resultsmentioning

confidence: 98%

See 1 more Smart Citation

Synthesis and solution properties of poly[N,N'-(p-phenylene)-3,3',4,4'-biphenyltetracarboxylic acid diamide]

Swanson¹,

Cotts²,

Siemens³

et al. 1991

Macromolecules

View full text Add to dashboard Cite

Section: Resultsmentioning

confidence: 98%

“…The hydrodynamic diameter, d,[7] as a function of M, calculated from the Yamakawa-Fujii expressions for the wormlike cylinder with persistence lengths q of 2, 3, and 4 nm. (L/q)3'2q3/M (10)where L is the contour length, q is the persistence length, and M is the molecular weight.…”

mentioning

confidence: 99%

Synthesis and solution properties of poly[N,N'-(p-phenylene)-3,3',4,4'-biphenyltetracarboxylic acid diamide]

Swanson¹,

Cotts²,

Siemens³

et al. 1991

Macromolecules

View full text Add to dashboard Cite

“…3 In multilevel interconnection packaging, polyimides seem to be very good candidates as dielectric materials. [4][5][6][7] In these applications, one of the major concerns about the use of polyimides is dimensional stability. This is because the applied polyimide film may have a thermal expansion coefficient different from that of the substrate.…”

Section: Introductionmentioning

confidence: 99%

Effect of thermal curing on the structures and properties of aromatic polyimide films

Jou¹,

Huang²

1991

Macromolecules

View full text Add to dashboard Cite

The effect of thermal curing on the thermal expansion coefficients (TECs) and morphologies of films of PMDA-ODA (pyromellitic dianhydride-4,4'-oxydianiline) and PMDA-PD A (p-phenylenediamine) has been examined by using the techniques of FTIR (Fourier transform infrared), X-ray diffractometry, and bending beam. The TECs varied significantly with annealing temperature before the films were fully cured. The PMDA-ODA film was nearly fully cured when annealed at 300 °C, while the same was true for PMDA-PDA at 250 °C. The morphology of the PMDA-ODA film did not vary with annealing, while that of PMDA-PDA changed from low to relatively high ordering when annealed at temperatures from 100 to 250 °C. During annealing of the PMDA-PDA film at 150 °C, a substantial amount of intermolecular links formed. Some of the links disappeared when the film was further annealed at 350 °C and above.

show abstract

“…Polyimide films exhibit good thermal stability, high mechanical strength and chemical resistance. These properties allow their use in harsh industrial applications including automotive, aerospace and electronics. − Common polyimides are not soluble in solvents and they degrade when heated due to their high T g . Because of these restrictions, a two step process was developed to produce high quality polyimide films. − First, a precursor polyamic acid (PAA) is synthesized that is soluble in polar, high boiling point solvents such as NMP ( N -methyl-2-pyrrolidone), DMAc (dimethylacetamide), and DMF (dimethylformamide) .…”

Section: Introductionmentioning

confidence: 99%

Real-Time Characterization of Physical Changes in Polyimide Film Formation: From Casting to Imidization

Ünsal

Cakmak

2013

Macromolecules

View full text Add to dashboard Cite

Drying and imidization of PMDA−ODA solutions in NMP were investigated by a novel custom designed measurement system that tracks real time weight, thickness, surface temperature, and in-plane and out-of-plane birefringence. At low temperature drying stage, the weight and thickness reductions occurred rapidly as a result of solvent evaporation. All the parameters started leveling off while the out of plane birefringence steadily increased and reached a plateau at longer drying times. When the temperature was increased for imidization reaction, additional weight loss accompanied by temporary reduction of birefringence was observed due to evaporation of bound solvent as solvent molecules decomplexed from the polymer chains and plasticized the film. During the latter stage, out-of-plane birefringence rose rapidly due to increased intrinsic birefringence of the polymer chains due to imidization reaction and orientation of polymer chains with their chain axes preferentially oriented in the film plane. Throughout the whole process the in-plane birefringence remained zero. For the first time, these real time measurements allowed us to quantitatively show the dynamics between chain relaxation due to evaporation of the decomplexed solvent molecules, and orientation development due to decreased chain mobility caused by imidization reaction and increasing T g for the PMDA− ODA/NMP solutions. In addition, the dynamics of this interplay was investigated by varying the processing conditions: initial casting thickness and drying temperature.

show abstract

A new multilevel interconnection system for submicrometer VLSI's using multilayered dielectrics of plasma Silicon Oxide and low-thermal-expansion polyimide

Cited by 21 publications

References 9 publications

Synthesis and solution properties of poly[N,N'-(p-phenylene)-3,3',4,4'-biphenyltetracarboxylic acid diamide]

Synthesis and solution properties of poly[N,N'-(p-phenylene)-3,3',4,4'-biphenyltetracarboxylic acid diamide]

Effect of thermal curing on the structures and properties of aromatic polyimide films

Real-Time Characterization of Physical Changes in Polyimide Film Formation: From Casting to Imidization

Contact Info

Product

Resources

About