Abstract:Time-dependent dielectric breakdown (TDDB) of thin gate oxides is an important reliability issue of MOS integrated circuits. Breakdown characteristics of thin gate oxides are measured under constant voltage stress (CVS). Effects of the gate voltage and gate oxide area on charge to breakdown Q bd are discussed. The experimental results show that Q bd is not a constant; Q bd depends on both the gate oxide area and stress voltage and cannot act as the breakdown criterion over a wider stress range. Based on experi… Show more
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