Abstract:The solder ball shear test is a commonly used method to evaluate the attachment strength of solder balls. However, some previous studies indicated that the solder ball shear test may not be suitable for showing the effect of intermetallic compound (IMC) growth due to thermal aging. This is because the IMC layer is thin and not susceptible to the shear loading. Since the IMC layer consists of brittle materials, the ball pull test should be a better method to evaluate the solder ball attachment strength. The maj… Show more
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