A new method for measuring the strength and ductility of thin films

Read, David T.; Dally, J. W.

doi:10.1557/jmr.1993.1542

Cited by 112 publications

(49 citation statements)

References 5 publications

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“…Observations of the plastic response of thin films under direct tensile loading have also been reported for Ni, 22 Al, 23,24 Cu, 22,25 and multilayers. 26,27 Collectively, the data obtained support the view that the flow stress at a given level of plastic strain is higher in thin films than it is in chemically identical bulk samples and that flow stress usually increases with decreasing film thickness (or layer thickness in multilayers) and with decreasing grain size.…”

Section: Dislocation Plasticity In Thin Metal Filmsmentioning

confidence: 65%

Dislocation Plasticity in Thin Metal Films

Kraft¹,

Freund²,

Phillips³

et al. 2002

MRS Bull.

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This article describes the current level of understanding of dislocation plasticity in thin films and small structures in which the film or structure dimension plays an important role. Experimental observations of the deformation behavior of thin films, including mechanical testing as well as electron microscopy studies, will be discussed in light of theoretical models and dislocation simulations. In particular, the potential of applying strain-gradient plasticity theory to thin-film deformation is discussed. Although the results of all studies presented follow a "smaller is stronger" trend, a clear functional dependence has not yet been established.

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Section: Dislocation Plasticity In Thin Metal Filmsmentioning

confidence: 65%

Dislocation Plasticity in Thin Metal Films

Kraft¹,

Freund²,

Phillips³

et al. 2002

MRS Bull.

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“…Thicker 6 µm free-standing Cu samples were prepared through standard lithographic processes and substrate etching. These were tensile tested using special equipment, providing stress-strain curves [1].…”

Section: Methodsmentioning

confidence: 99%

“…Thin film mechanical properties can be measured by tensile testing of freestanding films [1] and by the microbeam cantilever deflection technique [2][3][4], but the easiest way is by means of nanoindentation, since no special sample preparation is required and tests can be performed quickly and inexpensively.…”

Section: Introductionmentioning

confidence: 99%

Microstructure and Mechanical Properties of Electroplated Cu Thin Films

Volinsky¹,

Vella²,

Adhihetty³

et al. 2000

MRS Proc.

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Copper films of different thicknesses of 0.2, 0.5, 1 and 2 microns were electroplated on top of the adhesion-promoting barrier layers on <100> single crystal silicon wafers. Controlled Cu grain growth was achieved by annealing films in vacuum.The Cu film microstructure was characterized using Atomic Force Microscopy and Focused Ion Beam Microscopy. Elastic modulus of 110 to 130 GPa and hardness of 1 to 1.6 GPa were measured using the continuous stiffness option (CSM) of the Nanoindenter XP. Thicker films appeared to be softer in terms of the lower modulus and hardness, exhibiting a classical Hall-Petch relationship between the yield stress and grain size. Lower elastic modulus of thicker films is due to the higher porosity and partially due to the surface roughness. Comparison between the mechanical properties of films on the substrates obtained by nanoindentation and tensile tests of the freestanding Cu films is made.

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“…Nanoindentation is an alternative test method to the freestanding film mechanical testing 1 and microbeam cantilever deflection techniques 2,3 for measuring mechanical properties of thin films. First applied over 20 years ago in the hard-drive industry, it is now commonly used for microelectronic components and thin films.…”

Section: Introductionmentioning

confidence: 99%

Nanoindentation of Au and Pt/Cu thin films at elevated temperatures

2004

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This paper describes the nanoindentation technique for measuring sputter-deposited Au and Cu thin films' mechanical properties at elevated temperatures up to 130°C. A thin, 5-nm Pt layer was deposited onto the Cu film to prevent its oxidation during testing. Nanoindentation was then used to measure elastic modulus and hardness as a function of temperature. These tests showed that elastic modulus and hardness decreased as the test temperature increased from 20 to 130°C. Cu films exhibited higher hardness values compared to Au, a finding that is explained by the nanocrystalline structure of the film. Hardness was converted to the yield stress using both the Tabor relationship and the inverse method (based on the Johnson cavity model). The thermal component of the yield-stress dependence followed a second-order polynomial in the temperature range tested for Au and Pt/Cu films. The decrease in yield stress at elevated temperatures accounts for the increased interfacial toughness of Cu thin films.

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A new method for measuring the strength and ductility of thin films

Cited by 112 publications

References 5 publications

Dislocation Plasticity in Thin Metal Films

Dislocation Plasticity in Thin Metal Films

Microstructure and Mechanical Properties of Electroplated Cu Thin Films

Nanoindentation of Au and Pt/Cu thin films at elevated temperatures

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