A new mechanism of surface phase formation on precipitation-hardening alloy under ion irradiation

Zhou, Qi; Hu, Rong; Sha, Gang

doi:10.1016/j.apsusc.2021.150358

Cited by 2 publications

(1 citation statement)

References 28 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…Ultra-precision machining technology with a smaller material resolution is the foundational tool of science and technology and has led the developing direction of modern manufacturing technology [ 1 , 2 ]. The most widely utilized ultra-high resolution processing technologies are nano-optical tweezers, atom force microscope (AFM), ion beam lithography, focused ion beam (FIB), and others [ 3 , 4 ].…”

Section: Introductionmentioning

confidence: 99%

Nonlinear Effects of Pulsed Ion Beam in Ultra-High Resolution Material Removal

et al. 2022

View full text Add to dashboard Cite

Ion beam sputtering is widely utilized in the area of ultra-high precision fabrication, coating, and discovering the microworld. A pulsed ion beam (PIB) can achieve higher material removal resolution while maintaining traditional ion beam removal performance and macro removal efficiency. In this paper, a 0.01 s pulse width beam is used to sputter atom layer deposition (ALD) coated samples. The nano-scale phenomenon is observed by high-resolution TEM. The results show that when the cumulative sputtering time is less than 1.7 s, the sputtering removal of solid by ion beam is accompanied by a nonlinear effect. Furthermore, the shortest time (0.05 s) and lowest thickness (0.35 nm) necessary to remove a uniform layer of material were established. The definition of its nonlinear effect under a very small removal amount guides industrial ultra-high precision machining. It reveals that PIB not only has high removal resolution on nanoscale, but can also realize high volume removal efficiency and large processing diameter at the same time. These features make PIB promising in the manufacturing of high power/energy laser optics, lithography objective lens, MEMS, and other ultra-high precision elements.

show abstract