A new interface bonding improvement method combined with precipitation and hot-pressing process to ameliorate the defects of para aramid paper

Xie, Ping; Li, Na; Zhao, Kairong; Cao, Yutong; Yu, Junrong; Wang, Yan; Hu, Zuming

doi:10.1016/j.compositesa.2024.108052

Composites Part A: Applied Science and Manufacturing

2024

DOI: 10.1016/j.compositesa.2024.108052

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A new interface bonding improvement method combined with precipitation and hot-pressing process to ameliorate the defects of para aramid paper

Ping Xie,

Na Li,

Kairong Zhao

et al.

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A new interface bonding improvement method combined with precipitation and hot-pressing process to ameliorate the defects of para aramid paper

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References 37 publications

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