A new fabrication method for microactuators with piezoelectric thin film using precision cutting technique

Yamagata, Yutaka; Mihara, Saki; Nishioki, N.; Higuchi, Toshiro

doi:10.1109/memsys.1996.493999

Cited by 7 publications

(4 citation statements)

References 1 publication

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“…For example, Yamagata et al [1] have used the microcutting process to fabricate a vibration gyro in combination with a piezo film deposition process. They have reported that microcutting offers several advantages including capability to process several materials, to create three-dimensional structures, and to provide good surface finish.…”

Section: Introductionmentioning

confidence: 99%

Evaluation of Atkins’ model of ductile machining including the material separation component

Subbiah

Melkote

2007

Journal of Materials Processing Technology

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Section: Introductionmentioning

confidence: 99%

Evaluation of Atkins’ model of ductile machining including the material separation component

Subbiah

Melkote

2007

Journal of Materials Processing Technology

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“…Due to the required normal forces and the delicacy of the parts to be machined, high precision cutting is perhaps one of the last techniques one would thought of as miniaturizable. Nevertheless, Yamagata et al [26] have explored milling and lathe machining. Using very precise mechanics to reduce the cut depth to 0.25 µm, they have made shafts with diameters as small as 10 µm, figure 28.…”

Section: Conventional Machining Adapted To Microstructuringmentioning

confidence: 99%

Microprocessing at the fingertips

Thornell

Johansson

1998

J. Micromech. Microeng.

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Microprocessing, or micromachining, is here approached in a broad rather than profound way. Following a short description of its origin in microelectronics is a classification of more recent advances into three-dimensional processing, anisotropy inducing techniques, stencil processing and conventional machining adapted to micromachining. For each process the major advantages and drawbacks are accounted for. Also, a representative result accompanies every presentation. In all, more than 20 processes are dealt with: wet etching, dry etching, Lithographie-Galvanoformung-Abformung (LIGA), grey-tone lithography, spatial forming, stereolithography, laser chemical processing, local electrodeposition, two-photon-absorbed photopolymerization, focused ion beam (FIB), electrochemically and ion-induced anisotropy, nanoparticle lithography, fast atom beam (FAB), dicing, assembling, lathe machining, milling, die forging and electro-discharge machining (MEDM and WEDG).

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“…Several techniques, such as LIGA [1,2] and stereo lithography [3,4], have been used for the fabrication of three-dimensional structures with a high-aspect ratio. In addition, advanced machining techniques, such as precision cutting [5], micro grinding [6] and micro electro-discharge machining [7] have also been used to produce some MEMS of submillimeter size. Although these techniques offer strong advantages, they are not useful for the fabrication of finer structures with a scale of several to a hundred nanometers or for machining on a curved or stepped structure.…”

Section: Introductionmentioning

confidence: 99%

Smart nano-machining and measurement system with semiconductive diamond probe

Unno

Kitamoto

Shibata

et al. 2001

Smart Mater. Struct.

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We have developed an ultraprecision machining system with an in situ STM function. For this purpose, we have made a semiconductive diamond probe of sufficient hardness to prevent deformation or damage occurring during machining and with a tunnel-current-detecting capability for the fabrication of three-dimensional nano-structures in any material, independent of hardness. In order to realize this system, we first constructed a high-resolution driving system with two single-tube three-dimensional piezoelectric devices as scanners. Test measurements with a conventional tungsten probe showed that this driving system could obtain STM images with a resolution of about 20 nm. Next, we developed a CVD molding technique for fabrication of the semiconductive diamond probe. A mold with a 70 µm × 70 µm square pyramidal pit was formed by anisotropic etching of (001)Si in potassium hydroxide (KOH) solution. Then, a semiconductive diamond thin film was deposited onto the pyramidal mold using hot-filament CVD. After removing the mold by wet etching, the resulting pyramidal diamond probe had a facial angle of 70.6 • and a tip radius of about 70 nm. In order to test the applicability of this semiconductive diamond probe, we machined polished Si (a typical hard-to-cut material) to form nano-scale grooves and square recesses, and then measured those machined structures in situ using the three-dimensional driving system. The results showed that this newly developed semiconductive diamond probe was effective both as a machining tool and as an STM probe.

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A new fabrication method for microactuators with piezoelectric thin film using precision cutting technique

Cited by 7 publications

References 1 publication

Evaluation of Atkins’ model of ductile machining including the material separation component

Evaluation of Atkins’ model of ductile machining including the material separation component

Microprocessing at the fingertips

Smart nano-machining and measurement system with semiconductive diamond probe

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