Proceedings. 1998 International Conference on Multichip Modules and High Density Packaging (Cat. No.98EX154)
DOI: 10.1109/icmcm.1998.670764
|View full text |Cite
|
Sign up to set email alerts
|

A new concept for using of Al-sheet as integrated substrate for one or multichip module package

Abstract: In this paper we present recent studies on the electromigration processes in Ag thin$lm parallel microstrip lines in MCM(D) structures. The basic concept is applying accelerated local drop-test of water solutions onto the surface of two adjacent lines, under a given voltage potential. These operational conditions are often met in the interconnection line buses, placed in the top assembly level of multilayered hybrid structures. The subject of investigations are MCM(D) developed on A1 -sheet carrier with intern… Show more

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...

Citation Types

0
0
0

Publication Types

Select...

Relationship

0
0

Authors

Journals

citations
Cited by 0 publications
references
References 2 publications
0
0
0
Order By: Relevance

No citations

Set email alert for when this publication receives citations?