A molecular dynamics study on thermal conductivity of thin epoxy polymer sandwiched between alumina fillers in heat-dissipation composite material

Tanaka, Kouichi; Ogata, Shūji; Kobayashi, Ryo; Tamura, Tomoyuki; Kouno, Teruya

doi:10.1016/j.ijheatmasstransfer.2015.05.080

Cited by 28 publications

(23 citation statements)

References 45 publications

(59 reference statements)

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“…Thus, the soft polymer can uniformly adhere on the integrated circuit (IC) surface and enhance the heat dissipation rate. 27 show that the matrix and particle interaction and also dispersion were even in hyper branched epoxy. The bonding between ceramic particles and polymer matrix plays a vital role.…”

Section: Role and Effect Of Filler/hybrid Filler Addition On Thermamentioning

confidence: 86%

“…For good heat dissipation, the composite composed of fillers/particles which has hard constituent in nature and polymer resin which is soft constituent in nature is mostly used. Thus, the soft polymer can uniformly adhere on the integrated circuit (IC) surface and enhance the heat dissipation rate . Z. Gao and L. Zhao synthesized nano‐hybrid fillers containing AlN/GE mix and micro‐Al 2 O 3 particles and achieved improvement in “K” of epoxy composite by adding these nano‐hybrid fillers.…”

Section: Role and Effect Of Filler/hybrid Filler Addition On Thermal mentioning

confidence: 99%

See 1 more Smart Citation

Role, effect, and influences of micro and nano‐fillers on various properties of polymer matrix composites for microelectronics: A review

Balasubramanian

Ramesh²

2018

Polymers for Advanced Techs

122

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Ever since the discovery of polymer composites, its potential has been anticipated for numerous applications in various fields such as microelectronics, automobiles, and industrial applications. In this paper, we review filler reinforced polymer composites for its enormous potential in microelectronic applications. The interface and compatibility between matrix and filler have a significant role in property alteration of a polymer nanocomposites. Ceramic reinforced polymeric nanocomposites are promising candidate dielectric materials for several micro‐ and nano‐electronic devices. Because of its synergistic effect like high thermal conductivity, low thermal expansion, and dielectric constant of ceramic fillers with the polymer matrix, the resultant nanocomposites have high dielectric breakdown strength. The thermal and dielectric properties are discussed in the view of filler alignment techniques and its effect on the composites. Furthermore, the effect of various surface modified filler materials in polymer matrix, concepts of network forming using filler, and benefits of filler alignment are also discussed in this work. As a whole, this review article addresses the overall view to novice researchers on various properties such as thermal and dielectric properties of polymer matrix composites and direction for future research to be carried out.

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Section: Role and Effect Of Filler/hybrid Filler Addition On Thermamentioning

confidence: 86%

Section: Role and Effect Of Filler/hybrid Filler Addition On Thermal mentioning

confidence: 99%

Role, effect, and influences of micro and nano‐fillers on various properties of polymer matrix composites for microelectronics: A review

Balasubramanian

Ramesh²

2018

Polymers for Advanced Techs

122

View full text Add to dashboard Cite

show abstract

“…A recent study has experimentally demonstrated that inclusion of silane compatibilizer significantly enhanced effective thermal conductivity at high concentration of a-alumina nanoparticles (Giang and Kim 2015). Thus, a nanocomposite composed of a-alumina nanofillers applied as thermally conductive material has exhibited agglomeration when sandwiched between nanometer-depth-polymers (Tanaka et al 2015). Hence, a recent study theoretically addressed effective heat conductivity of such a filler-polymer-filler-system (Giang and Kim 2015).…”

Section: Thermal Conductivity Of Inorganicnanoparticle-based Pncsmentioning

confidence: 99%

“…Here, NEMD simulation was applied in deriving effective thermal conductivity of bisphenol-A (bis-A)/ epoxy polymer subsystem with depth of 14-70 Å, inserted between two a-alumina slabs (Tanaka et al 2015). The influence of SC agent was also ascertained through inclusion of model molecules to the polymer subsystem.…”

Section: Thermal Conductivity Of Inorganicnanoparticle-based Pncsmentioning

confidence: 99%

Recently emerging trends in thermal conductivity of polymer nanocomposites

Idumah

Hassan²

2016

Reviews in Chemical Engineering

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Due to escalating power densities in electronics, information, communication, energy storage, aerospace, and automobile technologies, heat dissipation has become immensely essential for the efficient performance and reliability of photonic, electronics, optoelectronics, and other devices in order to proactively prevent premature failure due to overheating. The functionalization and synergistic inclusion of thermally conducting nanoparticles such as carbon derivatives and metallic and ceramic fillers into polymer matrices have resulted in development of thermally conducting polymer nanocomposites. This has enlarged the scope of application of these materials in areas hitherto restricted due to poor thermal conductivity and, therefore, opened broad windows of opportunities for polymer nanocomposites as emerging alternative replacements for metal components in various applications where effective heat dissipation is compulsory for device performance. Thus, this paper critically discusses globally emerging technologies applied in the development of thermally conductive polymer nanocomposites for various industrial applications.

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“…However, the intrinsic thermal conductivity of epoxy resin is very low (ca. 0.2 Wm −1 K −1 ) . If a filler is adequately selected, the polymer‐based composite is the most suitable material that can meet all of the above noted requirements.…”

Section: Introductionmentioning

confidence: 99%

Graphene nanoplatelet‐silica hybrid epoxy composites as electrical insulation with enhanced thermal conductivity

et al. 2017

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The efficient management of heat is a key issue when considering the performance of electrical devices. To reduce the probability of their failure an effective heat dissipation should be ensured. The thermal conductivity of pure epoxy is low and can be improved through the addition of fillers. Graphene has been considered as an adequate filler, due to its excellent thermal conductivity. However, graphene‐based composites also show a high electrical conductivity, which limits their application as an electrical insulation considerably. The presented work shows that it is possible to enhance thermal conductivity through the incorporation of a new class of hybrid filler, namely a masterbatch of graphene nanoplatelets (GNPs) and a standard filler like silica. This unique structural design combines the advantages of both, GNPs and silica powder, resulting in composites that not only show high thermal conductivity, but also preserve electrical insulation functionality. A modified processing method leads to the improvement of thermal conductivity. GNPs‐silica hybrid epoxy composites with only 2 wt% of GNPs reached 1.54 W/mK, whereas the volume resistivity remained at the level of 1015 Ω cm. The unique scientific aspect, namely temperature dependence of thermal conductivity, was studied. The presented novel hybrid composites show great potential in applications requiring electrical insulation with enhanced thermal conductivity in high voltage devices. POLYM. COMPOS., 39:E1682–E1691, 2018. © 2017 Society of Plastics Engineers

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A molecular dynamics study on thermal conductivity of thin epoxy polymer sandwiched between alumina fillers in heat-dissipation composite material

Cited by 28 publications

References 45 publications

Role, effect, and influences of micro and nano‐fillers on various properties of polymer matrix composites for microelectronics: A review

Role, effect, and influences of micro and nano‐fillers on various properties of polymer matrix composites for microelectronics: A review

Recently emerging trends in thermal conductivity of polymer nanocomposites

Graphene nanoplatelet‐silica hybrid epoxy composites as electrical insulation with enhanced thermal conductivity

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