A modeling of soldering adhesion forecast for the crystalline silicon solar cell

Abstract

The soldering process is an important research subject for photovoltaic application. The soldering adhesion is a critical factor to module reliabilities. In this study, it discloses a non-destroyed method for soldering adhesion forecast of crystalline silicon solar cells. Combine the soldering adhesion test, the bus bar surface roughness measures and a numerical method to develop a numerical model. It could quickly calculate the soldering adhesion, analysis the screen-printing performance and judge the root cause of the soldering failure. The adhesion simulation result is in agreement with the experiment. The error is less 3% between the simulation and the experiment.