A modeling methodology for thermal analysis of the PCB structure

Zhang, Yabin; Bagnoli, Paolo

doi:10.1016/j.mejo.2014.04.042

Cited by 26 publications

(8 citation statements)

References 25 publications

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“…Discretizing the whole structure is a shortcoming in numerical methods [10,15,16]. Instead, the classic Fourierseries method [12][13][14][17][18][19][20][21] has immunity to the aspect ratio between the whole structure and heat sources, so that the structure is usually not necessary to be fully discretized and only the temperature distribution of expected regions or points have to be solved.…”

Section: Previous Work Of the Numerical-analytical Coupling Methods For Steady-state Thermal Analysis Of The Pcb Structurementioning

confidence: 99%

“…In the coupling method, the analytical solution was applied first for the insulating layer in the core of the PCB based on Cartesian coordinate [13,14]. The Finite Volume Method (FVM) was then applied for taking into account the nonhomogeneity of the core structure, especially the heatspreading contribution of metal layers and vias [12,13].…”

Section: Previous Work Of the Numerical-analytical Coupling Methods For Steady-state Thermal Analysis Of The Pcb Structurementioning

confidence: 99%

“…Thermal modeling of the PCB has been considered as an effective way to evaluate the capability of thermal diffusion of the PCB and to estimate components' temperature [1][2][3][4][5][6][7][8][9][10][11][12][13][14]. Historically, some modeling methods of analyzing the effective thermal conductivity of the PCB structure were investigated, such as the method of deriving the lumped thermal conductivity of the PCB [1,2] and the method of deriving the discrete thermal conductivity of orthogonal anisotropy (x, y, z direction in Cartesian coordinate) based on the PCB wiring diagram [3,4].…”

Section: Introductionmentioning

confidence: 99%

“…A test solver based on the coupling method was first developed in MATLAB with the uniform grid in Cartesian coordinate [12][13]. The precision of the coupling method has been verified through the modeling comparison with COMSOL [12][13][14]. In Section II, a brief introduction of the coupling method is given.…”

Section: Introductionmentioning

confidence: 99%

“…The Fourier-series analytical solution of temperature was mainly derived based on the assumed average heat transfer coefficient (HTC) of the PCB surface [13,14]. But under such simplified assumption, radiation heat transfer cannot be directly analyzed in the model.…”

Section: Introductionmentioning

confidence: 99%

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Improved Numerical-Analytical Thermal Modeling Method of the PCB With Considering Radiation Heat Transfer and Calculation of Components’ Temperature

Zhang

2021

IEEE Access

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The previous work relating to the numerical-analytical coupling method for steady-state thermal analysis of the laminated PCB structure is first briefly reviewed. The Fourier-series analytical solution of temperature and the finite volume method were linked together for thermally modeling the PCB. For further modeling the PCB with components, thermal-resistance parameters of the components are then used for correlating components' temperatures with the variable arrays in the coupling equations. For further considering radiation heat transfer between the PCB and the ambient, an iterative method is proposed. The radiation-equivalent heat transfer coefficient for each surface cell and each component can be updated during the iteration. Moreover, for improving the efficiency, the multigrid strategy is integrated in the coupling method for generating discrete cells of three levels in the metal layer and PCB surface region. To testify the iterative method, the model of a simple one-layer structure is compared with that built in COMSOL Multiphysics. The modeling results of the PCB of a phantom DC-DC power supply under radiation heat transfer are also given and discussed, and the modeling accuracy is approximately derived based on Richardson's extrapolation.

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