A modeling approach to describe the adhesion of rough, asymmetric particles to surfaces

Eichenlaub, Sean; Kumar, Gautam; Beaudoin, Stephen P.

doi:10.1016/j.jcis.2006.03.010

Cited by 30 publications

(22 citation statements)

References 21 publications

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“…Numerous studies have reported that the adhesion force between two surfaces is not a single value but is described by a distribution of values as also found in this work [19,43,44]. This has been attributed to the fact that the properties of the asperities in the contact area (heights and curvature radii) can vary from one point on the surface to another, particularly, when the adhesion occurs between small contact areas (in the order of μm 2 ) containing a few asperities.…”

Section: Discussionsupporting

confidence: 64%

Multi-asperity elliptical JKR model for adhesion of a surface with non-axially symmetric asperities

Perni

Prokopovich

2015

Tribology International

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a b s t r a c tSurfaces can present high levels of topographic asymmetry and, therefore, theories based on the assumption of symmetry cannot be effectively employed.A new multi-asperity adhesion model that assumes that asperities are not perfectly hemispherical is presented here, this model is based on the elliptical JKR model for a single asperity. The adhesion between a soft tissue with asperities greatly asymmetric and a polymer was modelled, the predicted adhesion forces were successfully validated against experimentally obtained data. Moreover, simulations with a simpler model, which assumes symmetrical asperities, have been also carried out; these results were significantly different from those obtained, using both the newly developed model and those determined experimentally. This highlights the importance of the model presented in this work.

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Section: Discussionsupporting

confidence: 64%

Multi-asperity elliptical JKR model for adhesion of a surface with non-axially symmetric asperities

Perni

Prokopovich

2015

Tribology International

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“…The zeta potential values for the silica and PSL particles attached to the AFM tips were determined previously elsewhere [20]. At neutral pH in a 10mM electrolyte, PSL has a zeta potential value of about −26 mV, and silica has a value of about −39 mV.…”

Section: Resultsmentioning

confidence: 99%

Surface forces and protein adsorption on dextran- and polyethylene glycol-modified polydimethylsiloxane

Farrell

Beaudoin

2010

Colloids and Surfaces B: Biointerfaces

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Dextran and polyethylene glycol (PEG) are often covalently bound to the surface of polydimethylsiloxane (PDMS) for the purpose of modifying its hydrophilicity and biocompatibility. In this work, the effects of the dextran and PEG on the morphology, wetting, and surface charge of the resulting surfaces were quantified and correlated with changes in the amount of fibrinogen and albumin adsorbed from aqueous solution. PDMS films were functionalized in a microwave oxygen plasma to create surface hydroxyl groups that were subsequently aminated by incubation in a (3-aminopropyl)trimethoxysilane (APTES) solution. Oxidized dextran and PEGaldehyde were linked to the surface amines via reductive amination. This process resulted in low surface coverage of immobilized PEG in the end-on conformation and a more uniform and dense distribution of side-on immobilized dextran. The immobilized dextran reduced the contact angle of the PDMS film from 109° to 80° and neutralized the zeta potential over the pH range from 3 to 11. An atomic force microscope was used to measure the interaction force between the modified PDMS and a model hydrophobic surface (polystyrene latex) and a model hydrophilic surface (silica) in both water and electrolyte solutions to show that van der Waals and hydrophobic attractive forces are the dominant forces for protein adsorption in this system. The PEG-and dextran-modified PDMS were exposed to BSA and fibrinogen to test their resistance to protein adsorption. The coatings were ineffective at reducing the adsorption of either molecule, and the dextran-modification of the PDMS caused more BSA to adsorb than in the case of the unmodified PDMS.

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“…This observation along with the particle agglomerate structure and inherent wafer surface roughness indicate a distribution in the adhesion energies between the contaminant particles and the wafer surface. 35 Cleaning suspensions.-The wet-cleaning solution, a proprietary chemical formulation of Lam Research Corporation, 30 is a suspension of saponified ammonium-based fatty-acid solids made by mixing fatty acid with alkaline water. Under these conditions, the resulting insoluble fatty-acid solids are negatively charged.…”

Section: Methodsmentioning

confidence: 99%

Silicon-Wafer Cleaning with Aqueous Surfactant-Stabilized Gas/Solids Suspensions

Андреев

Freer

Larios

et al. 2011

J. Electrochem. Soc.

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As feature sizes in the microelectronics industry diminish, cleanliness becomes an ever more important requirement. In response to these challenges, a novel wet-cleaning technology was developed at Lam Research Corporation to remove strongly adhered contaminants. An alkaline, foamed aqueous dispersion of insoluble platelet solids flows in linear shear past a particle-contaminated surface. Contaminant removal increases with solids concentration, foam quality, process time, and shear rate and can approach 100%. Particle-removal experiments indicate that dispersed solids are necessary for contaminant removal. Exponential decline of adhered particles with number of immersion/withdrawal events and a linear increase in the rate of particle removal with solids concentration indicate that the removal mechanism is binary collision between the insoluble fatty-acid platelets and Si 3 N 4 contaminant particles. Foam or surfactant solution alone is not effective in particle removal. A binary-collision rate model is derived to relate particle detachment to contact time. The binary-collision rate law agrees well with experimental removal data and provides a powerful design tool to assess the role of cleaning parameters, including process time, shear rate, dispensing flow rate, system geometry, solids concentration, and foam quality.Conventional metal-oxide-semiconductor manufacture of microelectronic devices can require over 100 process steps entailing deposition, removal, and alteration of material. For each step, processing, handling, and transport of the silicon wafers generates or transfers particulate contamination that can adversely affect device performance. The impact of particulate contamination can be drastic, significantly diminishing device yield; the trend toward smaller etch features exacerbates the problem as a single Ͻ100-nm contaminant particle can render a chip inoperative. In addition to efficient contaminant removal, cleaning processes must not damage features on the wafer and must not lose native material from the surface ͑film loss͒. Accordingly, an entire subindustry, primarily focused on wet cleaning, has emerged to remove particulate contamination. 1,2 Contaminant removal relies on the relative magnitudes of adhesion and detachment forces. Hence, successful detachment depends not only on particle-substrate chemistry but also on contaminant morphology and size. 3-7 All alternatives for cleaning wafers, including those few utilizing nonaqueous fluids, 1,8 require some means of supplying the energy necessary to remove a particle from a siliconwafer surface, 6 in addition to chemical action of the cleaning solution. 9 Standard methods of providing mechanical energy include undercutting, 10 brush scrubbing, 7,11,12 megasonics, 3,5,13,14 cryogenic aerosols, 15,16 and fluid jets. 17 Chemical undercutting of the particulate contamination by etching connecting bridges between the particle and substrate ͑in the case of chemical bonding͒ significantly improves particle-removal efficiencies ͑PREs͒ compared to simpl...

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A modeling approach to describe the adhesion of rough, asymmetric particles to surfaces

Cited by 30 publications

References 21 publications

Multi-asperity elliptical JKR model for adhesion of a surface with non-axially symmetric asperities

Multi-asperity elliptical JKR model for adhesion of a surface with non-axially symmetric asperities

Surface forces and protein adsorption on dextran- and polyethylene glycol-modified polydimethylsiloxane

Silicon-Wafer Cleaning with Aqueous Surfactant-Stabilized Gas/Solids Suspensions

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