A Model to Evaluate the Device-Level Performance of Thermoelectric Cooler with Thomson Effect Considered

Gong, Tingrui; Gao, Lei; Wu, Yongjia; Tan, Haoshu; Qin, Fangfang; Xin, Xiong; Shen, Limei; Li, Juntao; Ming, Tingzhen

doi:10.1007/s11630-022-1591-z

Cited by 7 publications

(4 citation statements)

References 32 publications

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“…Gong et al developed a one-dimensional thermodynamic model to evaluate the device-level performance of a thermoelectric cooler (TEC) with the Thomson effect. Similarly, they observed a greater influence of the Thomson effect on cooling capacity with the increasing current [30]. Despite these efforts, we still do not have an equivalent figure of merit defined for Thomson coolers and power generators.…”

Section: Thermoelectric Modulesmentioning

confidence: 90%

A Model for Material Metrics in Thermoelectric Thomson Coolers

Zebarjadi,

Akbari

2023

Entropy

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Thomson heat absorption corresponding to changes in the Seebeck coefficient with respect to temperature enables the design of thermoelectric coolers wherein Thomson cooling is the dominant term, i.e., the Thomson coolers. Thomson coolers extend the working range of Peltier coolers to larger temperature differences and higher electrical currents. The Thomson coefficient is small in most materials. Recently, large Thomson coefficient values have been measured attributed to thermally induced phase change during magnetic and structural phase transitions. The large Thomson coefficient observed can result in the design of highly efficient Thomson coolers. This work analyzes the performance of Thomson coolers analytically and sets the metrics for evaluating the performance of materials as their constituent components. The maximum heat flux when the Thomson coefficient is constant is obtained and the performance is compared to Peltier coolers. Three dimensionless parameters are introduced which determine the performance of the Thomson coolers and can be used to analyze the coefficient of performance, the maximum heat flux, and the maximum temperature difference of a Thomson cooler.

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Section: Thermoelectric Modulesmentioning

confidence: 90%

A Model for Material Metrics in Thermoelectric Thomson Coolers

Zebarjadi,

Akbari

2023

Entropy

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“…The thermoelectric generator based on functionally gradient material is analyzed and optimized [16]. A one-dimensional thermodynamic model of thermoelectric coolers was established, which is used to evaluate the performance at the device level [17]. However, most models assume invariable properties, reducing precision.…”

Section: Introductionmentioning

confidence: 99%

Nonlocal numerical simulation of thermoelectric coupling field by using peridynamic differential operator

Zhu,

Yu,

Zhu

et al. 2024

Preprint

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This study developed a novel nonlocal numerical model based on the peridynamic differential operator to analyze the thermoelectric coupling field. The thermoelectric coupling equations and boundary conditions are transformed from the classical partial differential form to the nonlocal integral form. By introducing the peridynamic function, a one-dimensional nonlocal model is established. This model can accurately capture the spatial distributions of the temperature field and material parameters when considering temperature-dependent thermoelectric material parameters. The numerical solutions from this nonlocal peridynamic model were found to agree well with those from the homotopy analysis method. Using this model, the influence of temperature boundary conditions and structure length on output performance is studied. The intrinsic relationship between the material parameters and the output properties within the structure is revealed. This presented nonlocal model provides an accurate mathematical tool to solve the thermoelectric coupling field for thermoelectric structures performance analysis.

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“…It was found that both boundary and size effects weakened the figure of merit of thermoelectric materials at the device level and that the larger the heat flux, the greater the influence of boundary effects. Gong et al [34] established a one-dimensional thermodynamic model of TEC device-level performance considering the Thomson effect, contact resistance, gap heat leakage, heat sink, and heat load and introduced dimensionless parameters to enable the model to be applied to the evaluation of TEC performance at different scales. However, to date, there is a lack of research on thin-film TECs that improve transient cooling performance by designing structures with small contact areas to reduce contact thermal resistance.…”

Section: Introductionmentioning

confidence: 99%

The Transient Cooling Performance of a Compact Thin-Film Thermoelectric Cooler with Horizontal Structure

Ming,

Liu,

Zhang

et al. 2023

Energies

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Thermoelectric cooling is an ideal solution for chip heat dissipation due to its characteristics of no refrigerant, no vibration, no moving parts, and easy integration. Compared with a traditional thermoelectric device, a thin-film thermoelectric device significantly improves the cooling density and has tremendous advantages in the temperature control of electronic devices with high-power pulses. In this paper, the transient cooling performance of a compact thin-film thermoelectric cooler with a horizontal structure was studied. A 3D multi-physics field numerical model with the Thomson effect considered was established. And the effects of impulse current, thermoelectric leg length, pulse current imposition time, and the size of the contact thermal resistance on the cooling performance of the device were comprehensively investigated. The results showed that the model achieved an active cooling temperature difference of 25.85 K when an impulse current of 0.26 A was imposed. The longer the length of the thermoelectric leg was, the more unfavorable it was to the chip heat dissipation. Due to the small contact area between different sections of the device, the effect of contact thermal resistance on the cooling performance of the device was moderate.

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A Model to Evaluate the Device-Level Performance of Thermoelectric Cooler with Thomson Effect Considered

Cited by 7 publications

References 32 publications

A Model for Material Metrics in Thermoelectric Thomson Coolers

A Model for Material Metrics in Thermoelectric Thomson Coolers

Nonlocal numerical simulation of thermoelectric coupling field by using peridynamic differential operator

The Transient Cooling Performance of a Compact Thin-Film Thermoelectric Cooler with Horizontal Structure

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