A miniaturized laser illumination module

Abstract

We present a wafer-based technology for mass production of miniaturized laser units. Heart of the approach is a glass wafer, comprising a metal structure acting as electrical contact, optical aperture and mechanical carrier of up to several thousands of flipped surface emitting laser diodes on one side, and a polymer-on-glass micro optical array on the other side. Mounting and characterization methods performed on wafer level are presented. After separation the size of a single laser unit is as small as 640 x 700 x 1400 μm3 and achieves spot diameters below 1 mm at distance of 120 mm. Performance and excellent cost potential allows for application in optical micro sensors and consumer electronics