A MIM driven Display with Colour Filters on 2″ diagonal Plastic Substrates

Abstract

We report an active-matrix display with colour filters presumably using plastic substrates for the first time. The fabrication and characterisation of Ta 2 O 5 based and bridge type MIM devices applying an TaAl alloy as new ductile bottom electrode material is described. The realisation of the corresponding low temperature absorptive colour filter, the TN-cell assembly and TAB bonding techniques on polymer substrates are presented.

OLED Displays on Plastic

“…It may not be possible to fulfill all of the mechanical and electrical properties with a single metal (Baeuerle et al 1999). Multilayer stacks or alloys can be used to tune specific properties.…”

21.3: Flexible Color AM‐OLED Display Fabricated Using Surface Free Technology by Laser Ablation/Annealing (SUFTLA®) and Ink‐jet Printing Technology

“…A process capable of directly fabricating flexible active electronic devices on a plastic substrate is a critical enabling technology [5][6][7][8][9][10][11]. Low-temperature poly-Si TFTs (LTPS-TFTs) can be fabricated directly onto a plastic substrate [11] if the maximum process temperature is drastically reduced, to below the allowable temperature of the plastic material.…”

Low‐temperature poly‐Si TFT transferred onto plastic substrates by using surface free technology by laser ablation/annealing (SUFTLA®)

“…The most popular method for manufacturing such devices is a direct fabrication process on plastic substrates, which have high-temperature durability. [1][2][3][4][5][6][7] T h e major pro blems in the d irect fabrication process are lowering the maximum process temperature below the allowable temperature of the plastic substrate and dimensional instability of the substrate during photolithography or wet processing due to the moisture absorption of polymer materials. These problems are actively studied by some researchers and experiments have resulted in good TFT performance without exceeding temperatures of about 150°C or less when applying low-temperature deposition techniques such as sputtering or plasma-enhanced CVD.…”