2020
DOI: 10.1109/tcsi.2020.2964574
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A Millimeter-Wave Reconfigurable On-Chip Coupler With Tunable Power-Dividing Ratios in 0.13-$\mu$ m BiCMOS Technology

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Cited by 22 publications
(5 citation statements)
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“…Although there are two different index modulators cascaded together to constitute a super modulator, the basic framework of OFDM-CIM is still the same as that of OFDM-IM. For brevity, we omit the superscript of the vector in formula (15). The cascaded multiple index modulators can be treated as a super index modulator, which is similar to that of conventional OFDM-IM.…”
Section: Optimal ML Detectormentioning
confidence: 99%
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“…Although there are two different index modulators cascaded together to constitute a super modulator, the basic framework of OFDM-CIM is still the same as that of OFDM-IM. For brevity, we omit the superscript of the vector in formula (15). The cascaded multiple index modulators can be treated as a super index modulator, which is similar to that of conventional OFDM-IM.…”
Section: Optimal ML Detectormentioning
confidence: 99%
“…Considering the orthogonality of the subcarriers in the subblock, the optimal ML detection can be carried out in subcarrier-wise. According to the received signal model in formula (15), the received signal model of the nth subcarrier can be expressed as…”
Section: Optimal ML Detectormentioning
confidence: 99%
See 1 more Smart Citation
“…In addition, in light of today's crowded radio spectrum and the multistandard RF (radio frequency) frontends in modern telecommunication systems demanding high-performance devices, reconfigurable RF/microwave circuits have become a very important topic of research. As an essential component, various frequency-tunable [1][2][3][4][5] and power-dividing ratiotunable [6][7][8][9] quadrature couplers emerged. In [6], the coupler not only has a narrow adjustment range of powerdividing ratio but also belongs to a double-layer structure.…”
Section: Introductionmentioning
confidence: 99%
“…Introduction: In the design of integrated circuits (ICs) for front-end systems, passive devices such as bandpass filters (BPFs) [1][2][3][4][5][6][7][8][9][10][11][12], power dividers [13][14][15] and couplers [16][17][18] usually occupy relatively large layout space. In order to reduce the yield cost of ICs, miniaturized design of passive devices is attracting increasing attention.…”
mentioning
confidence: 99%