A Micromachined Silicon Resonant Pressure Sensor

Wang, Junbo; Chen, Deyong; Xie, Bin; Chen, Jian; Zhu, L. X.; Lu, Yulan

doi:10.1007/978-981-10-5945-2_15

Cited by 5 publications

(1 citation statement)

References 54 publications

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“…To measure dynamic changes, piezoelectric sensors can be used, but they are not sensitive for static pressure [ 7 ]. Recent developments for highly accurate sensors are based on resonant detection mechanisms [ 10 , 11 ].…”

Section: Introductionmentioning

confidence: 99%

Characterization of a PCB Based Pressure Sensor and Its Joining Methods for the Metal Membrane

Schwenck

Grözinger

Günther

et al. 2021

Sensors

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Essential quality features of pressure sensors are, among other accuracy-related factors, measurement range, operating temperature, and long-term stability. In this work, these features are optimized for a capacitive pressure sensor with a measurement range of 10 bars. The sensor consists of a metal membrane, which is connected to a PCB and a digital capacitive readout. To optimize the performance, different methods for the joining process are studied. Transient liquid phase bonding (TLP bonding), reactive joining, silver sintering, and electric resistance welding are compared by measurements of the characteristic curves and long-term measurements at maximum pressure. A scanning electron microscope (SEM) with energy-dispersive X-ray spectroscopy (EDX) analysis was used to examine the quality of the joints. The evaluation of the characteristic curves shows the smallest measurement errors for TLP bonding and sintering. For welding and sintering, no statistically significant long-term drift was measured. In terms of equipment costs, reactive joining and sintering are most favorable. With low material costs and short process times, electric resistance welding offers ideal conditions for mass production.

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Section: Introductionmentioning

confidence: 99%