A micromachined, shadow-mask technology for the OMVPE fabrication of integrated optical structures

Peake, Gregory M.; Zhang, L; Li, N. Y.; Sarangan, Andrew; Wilison, C. G.; Shui, R. J.; Hersee, S.D.

doi:10.1007/s11664-000-0100-x

Cited by 5 publications

(2 citation statements)

References 10 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…Because of this flexibility, laser micromachining allows for the processing of a variety of materials. Figure 1 compares laser micromachining to three commonly used direct-write microfabrication methods [13][14][15][16][17][18][19]. All these methods involve a mechanism for removing material directly from a substrate in a desired pattern using computer-controlled machinery.…”

Section: Introductionmentioning

confidence: 99%

Low-Power, Multimodal Laser Micromachining of Materials for Applications in sub-5 µm Shadow Masks and sub-10 µm Interdigitated Electrodes (IDEs) Fabrication

Hart

Rajaraman

2020

Micromachines

View full text Add to dashboard Cite

Laser micromachining is a direct write microfabrication technology that has several advantages over traditional micro/nanofabrication techniques. In this paper, we present a comprehensive characterization of a QuikLaze 50ST2 multimodal laser micromachining tool by determining the ablation characteristics of six (6) different materials and demonstrating two applications. Both the thermodynamic theoretical and experimental ablation characteristics of stainless steel (SS) and aluminum are examined at 1064 nm, silicon and polydimethylsiloxane (PDMS) at 532 nm, and Kapton ® and polyethylene terephthalate at 355 nm. We found that the experimental data aligned well with the theoretical analysis. Additionally, two applications of this multimodal laser micromachining technology are demonstrated: shadow masking down to approximately 1.5 µm feature sizes and interdigitated electrode (IDE) fabrication down to 7 µm electrode gap width.

show abstract

Section: Introductionmentioning

confidence: 99%

Low-Power, Multimodal Laser Micromachining of Materials for Applications in sub-5 µm Shadow Masks and sub-10 µm Interdigitated Electrodes (IDEs) Fabrication

Hart

Rajaraman

2020

Micromachines

View full text Add to dashboard Cite

show abstract

“…The shadow masks were required for metal pattern deposition of geometrically specific heaters on a soft polymer film that is incompatible with standard photolithography techniques. Designing and fabricating shadow masks with silicon has been previously accomplished by generally using one of two methods: (1) deep reactive ion etching (DRIE) of an entire patterned silicon wafer with rather precise pattern transfer via metal deposition [8]; or (2) DRIE for initially removal of material to a pre-determined depth from the wafer's backside to define the mask features followed by partial wet etching (e.g. KOH) on the front side to etch-through the remaining material [9,10].…”

Section: Introductionmentioning

confidence: 99%