A Microcontact-Printed Nickel-Passivated Copper Grid Electrode for Perovskite Photovoltaics

Abstract

We report a novel transparent copper-based grid electrode fabricated by microcontact printing that offers high stability toward oxidation in air. Passivation is achieved using a 2.5 nm thick layer of nickel buried just below the surface of the copper film from which the grid is etched. This approach to electrode passivation retains the advantages associated with using microcontact printing lithography for grid fabrication of very fast resist deposition and compatibility with the low cost, low toxicity etchant ammonium persulfate. The processes of patterned resist deposition and metal etching is complete within less than 1 min. Using this approach, a grid electrode with a far-field transparency of 82% across the wavelength range 300–900 nm and a sheet resistance of 6.8 Ω sq−1 is demonstrated, which is shown to be a promising alternative to indium-tin oxide as the transparent electrode in perovskite photovoltaic devices.

Self‐Encapsulated Cu Grid for Highly Transparent Conductive Electrode for Transparent Heater and Electrochemical Supercapacitor Applications

“…On other hand, due to its brittle nature under bending strain, ITO is not appropriate for flexible Cu with dielectric and carbon materials. [16][17][18][19] Kim et al fabricated multilayered stacked Cu 2 O/Cu/Cu 2 O to solve the transmittance issue, but this increased the sheet resistance to about 15.1 Ω □ −1 with 89% transmittance without the reflectance. [20] However, this multilayered electrode was developed using etching and sputtering.…”

“…To solve these issues, researchers developed the hybrid metallic mesh electrode by combining Cu with dielectric and carbon materials. [ 16–19 ] Kim et al. fabricated multilayered stacked Cu 2 O/Cu/Cu 2 O to solve the transmittance issue, but this increased the sheet resistance to about 15.1 Ω □ −1 with 89% transmittance without the reflectance.…”