2022 IEEE International Symposium on Electromagnetic Compatibility &Amp; Signal/Power Integrity (EMCSI) 2022
DOI: 10.1109/emcsi39492.2022.9889490
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A Methodical Approach for PCB PDN Decoupling Minimizing Overdesign with Genetic Algorithm Optimization

Francesco de Paulis
1
,
Yifan Ding
2
,
Matteo Cocchini
3
et al.
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Cited by 4 publications
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System Level PDN Impedance Optimization Utilizing the Zeros of the Decoupling Capacitors

Ding,
Liang,
De Paulis
et al. 2023
2023 IEEE Symposium on Electromagnetic Compatibility &Amp; Signal/Power Integrity (EMC+SIPI)
1
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System Level PDN Impedance Optimization Utilizing the Zeros of the Decoupling Capacitors

Ding,
Liang,
De Paulis
et al. 2023
2023 IEEE Symposium on Electromagnetic Compatibility &Amp; Signal/Power Integrity (EMC+SIPI)
1
0
0
0
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Equivalent Force Extraction Methodology for Electrical Component Induced PCB Vibration

Ding,
Zhang,
Xue
et al. 2024
IEEE Trans. Electromagn. Compat.
2
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Multilayer Ceramic Capacitor Vibration Source Model Library Development

Ding,
Xue,
Zhang
et al. 2024
IEEE Trans. Electromagn. Compat.
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