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2009 IEEE International Symposium on Sustainable Systems and Technology 2009
DOI: 10.1109/issst.2009.5156715
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A method to reuse fiber-reinforced waste from e-waste as filler for polymeric composite

Abstract: REPREG materials (PM) which are reclaimed from waste printed circuit boards industry was used to produce polymeric composites by an extrusion and injection process through adding polypropylene (PP) as a bonding agent. The results show that the increments of tensile strength, tensile modulus, flexural strength and flexural modulus of the PP composites are greatly achieved than unfilled PP. The maximum content of waste PM in polymeric composites was 30 wt%, of which the strength of tensile, flexural and impact p… Show more

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