A Method of Thermal Analysis for CMOS Integrated Circuit

Sun, Jingying; Feng, Shiwei; Meng, Hao; Yuezong, Zhang; Liu, Jing; Cheng, Liang

doi:10.1109/icsict.2006.306237

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Thermal Simulation Methods1

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Cited by 4 publications

(1 citation statement)

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“…There are currently several thermal simulators available. ANSYS [8], Thermal3D [9] and FloTHERM [10] are based on FEM; ILLIADS-T [11] is a fast thermal simulator but it needs a customized SPICE model, which is not provided by the foundry. HeatWave [12] can read GDSII files directly so that the complicated task of abstracting the layout information from the GDSII file could be avoided.…”

Section: Thermal Simulation Methodsmentioning

confidence: 99%

Thermal Analysis for the proto-VIPRAM00 chip

et al. 2015

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Thermal analysis has been essential in designing reliable ICs. This becomes even more critical when multiple thin dies are stacked together to form a 3D integration. This paper presents our work on thermal modeling, analysis, and simulations on the first 2D prototype of Vertically Integrated PRAM (proto-VIPRAM00) chip. We proposed a sub-circuit-block level thermal simulation approach using Fourier heat flow model, where one CAM cell in proto-VIPRAM00 is used as a unit heat source. This approach significantly reduces the simulation time and computing resources while providing efficient and accurate thermal/temperature simulations in both 2D and 3D IC scenarios.

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Section: Thermal Simulation Methodsmentioning

confidence: 99%