A method for seeking high thermal conductivity compounds

Terada, Yoshihiro; Nakata, Junji; Mohri, Tetsuo; Suzuki, Tomoo

doi:10.1016/s0966-9795(97)00057-5

Cited by 8 publications

(5 citation statements)

References 20 publications

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“…The thermal conductivity data are provided by our group. 32,33,45,87) Note that the thermal conductivity of NiAl obtained by Darolia,8) and that of NiTi by Goff 26) and that of Ni 3 Al by Williams et al 27) are rather good agreement with our results.…”

Section: Identification Of Heat Carriersupporting

confidence: 92%

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Thermal Conductivity of Intermetallic Compounds with Metallic Bonding

et al. 2002

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Thermal conductivity is one of the key parameters required for high-temperature structural applications of metallic materials. In this overview, the thermal conductivity of intermetallic compounds are extensively described based mainly on our past works, since there had been less works in this research field. Emphasis is placed on the B2 and the L1 2 compounds with metallic bonding such as NiAl, Ni 3 Al, etc., which have been attracting attention for engineering applications at higher temperatures. The thermal conductivity data have been accumulated for the intermetallic compounds, and the phenomenological aspects are reviewed in detail as a function of alloy composition, constituent and temperature. The Wiedemann-Franz law is applicable to the intermetallic compounds, indicating that the carrier of thermal conduction is an electron rather than a phonon. The thermal conductivity of an intermetallic compound with the ordered crystal structure is characterized as an enhancement due to ordering with reference to the basic contribution of solid solution with the disordered crystal structure. It is demonstrated that the thermal conductivity of intermetallic compounds is reduced by the addition of a third element, and this subject is also covered.

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Section: Identification Of Heat Carriersupporting

confidence: 92%

“…It intermetallic compounds at stoichiometry. 32,33,45,87) The thermal conductivity data are provided by our group. A large scatter is observed in the electrical conductivity data of Cu 3 Au which were taken from different sources.…”

Section: Identification Of Heat Carriermentioning

confidence: 99%

Thermal Conductivity of Intermetallic Compounds with Metallic Bonding

et al. 2002

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“…The thermal conductivity will be high for lower valued ΔN compounds [29]. ΔN values for AgMg, CuZr, AuMg, AuTi, AuMn, AuZn and AuCd are 1, 3, 1, 3, 2, 1 and 1 respectively.…”

Section: Resultsmentioning

confidence: 99%

“…[28] and are presented in table 2. Thermal conductivities of the chosen materials are taken from [29] and is given in table 2. The calculated T D using eq.…”

Section: Resultsmentioning

confidence: 99%

Ultrasonic investigations in intermetallics

Singh¹,

Pandey²

2009

Pramana - J Phys

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Ultrasonic attenuation for the longitudinal and shear waves due to phononphonon interaction and thermoelastic mechanism have been evaluated in B2 structured intermetallic compounds AgMg, CuZr, AuMg, AuTi, AuMn, AuZn and AuCd along 1 0 0 , 1 1 1 and 1 1 0 crystallographic directions at room temperature. For the same evaluations, second-and third-order elastic constants, ultrasonic velocities, Grüneisen parameters, non-linearity parameter, Debye temperature and thermal relaxation time are also computed. Although the molecular weight of these materials increases from AgMg to AuCd, the obtained results are affected with the deviation number. Attenuation of ultrasonic waves due to phonon-phonon interaction is predominant over thermoelastic loss. Results are compared with available theoretical and experimental results. The results with other well-known physical properties are useful for industrial purposes.

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“…Included are various intermetallics, such as (Fe,Co,Ni,Pt,Ru,Ni 3 )Al and (Ni,Co,Fe)Ti, whose relatively high thermal conductivity and high temperature mechanical integrity find use as substrate heat sinks. 473,486,496,[565][566][567] Non-piezoelectric cubic representatives/polytypes are currently utilized also as magnetic materials (FeCo), superconductors (Cr 3 Si), batteries (NiCd), shape-memory alloys (NiTi, Cu 3 Al), coatings (NiAl), optical components (ZnO, TiN, CdTe), and in a large number of microelectronic components ((Y,Sc,Gd,Sm) 2 O 3 , (Ba,Sr,Ca,Pb)TiO 3 , (Pb,Sr)ZrO 3 , (Na,K)NbO 3 , KTaO 3 , BiFeO 3 , (Si,Hf,Zr)O 2 , (Mg,Ca,Sr)O, GeTe). 231,[352][353][354]426,568 As with point group 23, the linear elastic behavior of these m 3 and m 3m crystals is identical to those of class 43m; and, similarly, composite piezoelectric structures, including superlattices, fashioned of materials in both classes may also be characterized by standard means.…”

Section: 2mentioning

confidence: 99%

Acoustic properties of piezoelectric cubic crystals

Ballato

2023

Int J Ceramic Engine & Sci

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This paper is offered as a complementary adjunct to the many treatments of the electronic and photonic properties of cubic III–V and II–VI compounds appearing in the literature. These crystals typically exhibit piezoelectricity, due to the molecular dissymmetry, thereby allowing the inclusion of classical mechanical/acoustic features along with the quantum. We discuss the history of this modality and then illustrate its use by applying it to an electro‐elastic problem that has the estimable virtues of having an exact solution, along with wide practical applicability: determination of the piezocoupling values governing the excitation of thickness vibrations in thin cubic films or plates of arbitrary crystallographic orientation by electric fields directed either along, or lateral to, the thickness. Explicit results are given for orientations along the great‐circle paths connecting the principal directions [100], [110], and [111]. The formalism is then applied to GaAs as an example; it is further demonstrated that various results, such as the orientational variations of piezocoupling factors, are generally applicable to other members of the III–V and II–VI families by scaling. Ancillary aspects, such as errors due to misorientations, nonlinearities, and equivalent circuit representations, are described and discussed. This work is dedicated to Gerald W. Farnell (1925–2015), Prof. Emeritus, McGill University, Montréal, Canada.

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A method for seeking high thermal conductivity compounds

Cited by 8 publications

References 20 publications

Thermal Conductivity of Intermetallic Compounds with Metallic Bonding

Thermal Conductivity of Intermetallic Compounds with Metallic Bonding

Ultrasonic investigations in intermetallics

Acoustic properties of piezoelectric cubic crystals

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