A method for optimizing stencil cleaning time in solder paste printing process

Yu, Jiangyou; Cao, Le; Fu, Hao; Guo, Jun

doi:10.1108/ssmt-10-2018-0037

Cited by 4 publications

(6 citation statements)

References 22 publications

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“…This is probably one of the most critical processes in this technology; many of the reflow soldering failures (50-60 per cent) can be originated from the printing failures, as demonstrated by Tsai (2008). The yield of this process depends on the process parameters on the one hand, like printing velocity, squeegee pressure, or the stencil cleaning frequency, as investigated by Huang (2018) and by Yu et al (2019). The optimisation of the respective process parameters is absolutely critical, which can be carried out by empirical methods, by numerical modelling, or even by utilising machine learning techniques like in the paper of Martinek and Krammer (2019).…”

Section: Introductionmentioning

confidence: 99%

“…The yield of this process depends on the process parameters on the one hand, like printing velocity, squeegee pressure, or the stencil cleaning frequency, as investigated by Huang (2018) and by Yu et al (2019). The optimisation of the respective process parameters is absolutely critical, which can be carried out by empirical methods, by numerical modelling, or even by utilising machine learning techniques like in the paper of .…”

Section: Introductionmentioning

confidence: 99%

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Numerical investigation on the effect of solder paste rheological behaviour and printing speed on stencil printing

Krammer

Al-Ma'aiteh

Illés

et al. 2020

SSMT

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Purpose The purpose of this paper is to investigate the effect of different viscosity models (Cross and Al-Ma’aiteh) and different printing speeds on the numerical results (e.g. pressure over stencil) of a numerical model regarding stencil printing. Design/methodology/approach A finite volume model was established for describing the printing process. Two types of viscosity models for non-Newtonian fluid properties were compared. The Cross model was fitted to the measurement results in the initial state of a lead-free solder paste, and the parameters of a Al-Ma’aiteh material model were fitted in the stabilised state of the same paste. Four different printing speeds were also investigated from 20 to 200 mm/s. Findings Noteworthy differences were found in the pressure between utilising the Cross model and the Al-Ma’aiteh viscosity model. The difference in pressure reached 33-34% for both printing speeds of 20 and 70 mm/s and reached 31% and 27% for the printing speed of 120 and 200 mm/s. The variation in the difference was explained by the increase in the rates of shear by increasing printing speeds. Originality/value Parameters of viscosity model should be determined for the stabilised state of the solder paste. Neglecting the thixotropic paste nature in the modelling of printing can cause a calculation error of even approximately 30%. By using the Al-Ma’aiteh viscosity model over the stabilised state of solder pastes can provide more accurate results in the modelling of printing, which is necessary for the effective optimisation of this process, and for eliminating soldering failures in highly integrated electronic devices.

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Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Numerical investigation on the effect of solder paste rheological behaviour and printing speed on stencil printing

Krammer

Al-Ma'aiteh

Illés

et al. 2020

SSMT

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“…It is essential in real-world applications to analyze the conditions of the stencil aperture wall surface that corresponds to the solder paste release on the PCB pad during the stencil printing process. During the stencil printing process, this hidden issue affects the efficiency of solder paste release on the PCB pad Figure 1 Illustration of solder paste printing process (Alelaumi et al, 2020;Franke et al, 2021;Sunar et al, 2022;Yu et al, 2019). Research on the lifespan of the electroform PVD stencil and the quality of the stencil aperture wall surface is less common, and it has rarely been examined.…”

Section: Introductionmentioning

confidence: 99%

Effect of PVD-coated wall aperture roughness on the life span of fine-pitch stencil printing

Mohamed Sunar,

Abu Bakar,

et al. 2023

SSMT

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Purpose This paper aims to investigate the effect of physical vapor deposition (PVD)-coated stencil wall aperture on the life span of fine-pitch stencil printing. Design/methodology/approach The fine-pitch stencil used in this work is fabricated by electroform process and subsequently nano-coated using the PVD process. Stencil printing process was then performed to print the solder paste onto the printed circuit board (PCB) pad. The solder paste release was observed by solder paste inspection (SPI) and analyzed qualitatively and quantitatively. The printing cycle of up to 80,000 cycles was used to investigate the life span of stencil printing. Findings The finding shows that the performance of stencil printing in terms of solder printing quality is highly dependent on the surface roughness of the stencil aperture. PVD-coated stencil aperture can prolong the life span of stencil printing with an acceptable performance rate of about 60%. Originality/value Stencil printing is one of the important processes in surface mount technology to apply solder paste on the PCB. The stencil’s life span greatly depends on the type of solder paste, stencil printing cycles involved and stencil conditions such as the shape of the aperture, size and thickness of the stencil. This study will provide valuable insight into the relationship between the coated stencil wall aperture via PVD process on the life span of fine-pitch stencil printing.

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“…It is desirable to reduce unnecessary cleaning operations while keeping printing quality stable. Stencil printing process is essentially a stochastic degradation process (Yu et al, 2019). Stencil cleaning can be perceived as a maintenance activity for the stencil printing process.…”

Section: Introductionmentioning

confidence: 99%

Cleaning control of stencil printing subject to performance deterioration

Rui

Cao

et al. 2020

SSMT

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Purpose Most solder paste printers are configured to periodically clean the stencil to maintain printing quality. However, a periodical cleaning control may result in excessive cleaning operations. The purpose of this paper is to develop a control method to schedule stencil cleaning operations appropriately. Design/methodology/approach A hybrid failure rate model of the stencil printing process with age reduction factor and failure rate increase factor is presented. A stencil cleaning policy based on system reliability is introduced. An optimization model used to derive the optimal stencil cleaning schedule is provided. Findings An aperiodic stencil cleaning control with good adaptability is achieved. A comparative analysis indicates that aperiodic control has better printing system reliability than traditional periodical control under the same cleaning resource consumption. Originality/value Periodical cleaning control commonly used in industrial printing process often results in excessive cleaning operations. By incorporating the printing system reliability, this paper develops an aperiodic stencil cleaning control method based on hybrid failure rate model of the stencil printing process. It helps to reduce unnecessary cleaning operations while keeping printing quality stable.

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A method for optimizing stencil cleaning time in solder paste printing process

Cited by 4 publications

References 22 publications

Numerical investigation on the effect of solder paste rheological behaviour and printing speed on stencil printing

Numerical investigation on the effect of solder paste rheological behaviour and printing speed on stencil printing

Effect of PVD-coated wall aperture roughness on the life span of fine-pitch stencil printing

Cleaning control of stencil printing subject to performance deterioration

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