A Method and Device for Automated Grinding of Small Ceramic Elements

Kacalak, Wojciech; Lipiński, D.; Szafraniec, Filip; Bałasz, Błażej

doi:10.3390/ma14247904

Cited by 3 publications

(2 citation statements)

References 36 publications

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“…The specific energy in abrasive and erosive machining processes typically ranges from 10 to 1000 J/mm 3 [ 6 ]. The temperature exceeds 1200 °C in micro volumes; temperature gradients in the machining zone reach up to 106 °C/s and 103 °C/mm.…”

Section: Introductionmentioning

confidence: 99%

“…The variability of the recess of the abrasive grains in the workpiece material is an unfavorable but unavoidable feature of micro-cutting processes. Therefore, the specific energy of machining depends not only on the average values of the parameters of the layers cut by individual blades but also the range of variation and distribution of the values of these parameters [ 6 , 9 , 31 ].…”

Section: Introductionmentioning

confidence: 99%

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Metrological Aspects of Assessing Surface Topography and Machining Accuracy in Diagnostics of Grinding Processes

et al. 2023

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The paper presents probabilistic aspects of diagnostics of grinding processes with consideration of metrological aspects of evaluation of topography of machined surfaces and selected problems of assessment of machining accuracy. The processes of creating the geometric structure of the ground surface are described. It was pointed out that the distribution of features important for process diagnostics depends on the mechanism of cumulative effects of random disturbances. Usually, there is a multiplicative mechanism or an additive mechanism of the component vectors of relative displacements of the tool and workpiece. The paper describes a method for determining the classification ability of specific parameters used to evaluate stereometric features of ground surfaces. It is shown that the ability to differentiate the geometric structure of a certain set of surfaces using a selected parameter depends on the geometric mean of the differences in normalized and sorted, consecutive values of this parameter. A methodology is presented for evaluating the ability of various parameters to distinguish different geometric structures of surfaces. Further, on the basis of analyses of a number of grinding processes, a methodology was formulated for proceeding leading to a comprehensive evaluation of machining accuracy and forecasting its results. It was taken into account that in forecasting the accuracy of grinding, it is necessary to determine the deviations, arising under the conditions of multiplicative interaction of the effects of various causes of inaccuracy. Examples are given of processes in which, due to the deformation of the technological system, dependent on the position of the zone and machining force, varying temperature fields and tool wear, the distributions of dimensional deviations are not the realization of stationary processes. It was emphasized that on the basis of the characteristics of the dispersion of the deviation value in the sum set of elements, it is not possible to infer its causes. Only the determination of the “instantaneous” values of the deviation dispersion parameters allows a more complete diagnosis of the process.

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Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Metrological Aspects of Assessing Surface Topography and Machining Accuracy in Diagnostics of Grinding Processes

et al. 2023

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Technological Principles of Complex Plasma-Beam Surface Treatment of Al2O3/TiC and SiAlON Ceramics

Grigoriev,

Volosova,

Lyakhovetsky

et al. 2023

JMMP

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Thermomechanical action during high-performance diamond grinding of sintered cutting Al2O3/TiC and SiAlON ceramics leads to increased defectiveness of the surface layer of the deposited TiZrN and CrAlSiN/DLC coatings. It predetermines the discontinuous and porous coatings and reduces its effectiveness under abrasive exposure and fretting wear. The developed technological approach is based on “dry” etching with beams of accelerated argon atoms with an energy of 5 keV for high-performance removal of defects. It ensures the removal of the defective layer on ceramics and reduces the index of defectiveness (the product of defects’ density per unit surface area) by several orders of magnitude, compared with diamond grinding. There are no pronounced discontinuities and pores in the microstructure of coatings. Under mechanical loads, the coatings ensure a stable boundary anti-friction film between the ceramics and counter body that significantly increases the wear resistance of samples. The treatment reduces the volumetric wear under 20 min of abrasive action by 2 and 6 times for TiZrN and CrAlSiN/DLC coatings for Al2O3/TiC and by 5 and 23 times for SiAlON. The volumetric wear under fretting wear at 105 friction cycles is reduced by 2–3 times for both coatings for Al2O3/TiC and by 3–4 times for SiAlON.

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Modeling and Analysis of Micro-Grinding Processes with the Use of Grinding Wheels with a Conical and Hyperboloid Active Surface

et al. 2022

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In this article, a method of grinding small ceramic elements using hyperboloid and conical grinding wheels was presented. The method allowed for machining with a lower material removal speed and extending the grinding zone without reducing the efficiency of the process. In order to assess the process output parameters, numerical simulations were carried out for single-pass machining. This strategy allows for automation of the process. Grinding with a low material removal speed is recommended for the machining of small and thin elements, since this can avoid fracturing the elements. The methodology for selecting process parameters as well as the results of the abrasive grains activity analyses were presented. The analyses also concerned the roughness of machined surfaces and the variability of their textures. This grinding method was applied in the production of small ceramic elements that are used in the construction of electronic systems, and in the processing of small piezoceramic parts. This grinding technique could also be used in other grinding processes, where the removal of small machining allowances with high efficiency is required.

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A Method and Device for Automated Grinding of Small Ceramic Elements

Cited by 3 publications

References 36 publications

Metrological Aspects of Assessing Surface Topography and Machining Accuracy in Diagnostics of Grinding Processes

Metrological Aspects of Assessing Surface Topography and Machining Accuracy in Diagnostics of Grinding Processes

Technological Principles of Complex Plasma-Beam Surface Treatment of Al2O3/TiC and SiAlON Ceramics

Modeling and Analysis of Micro-Grinding Processes with the Use of Grinding Wheels with a Conical and Hyperboloid Active Surface

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