1984
DOI: 10.1063/1.333183
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A low-temperature process for annealing extremely shallow As+-implanted n+/p junctions in silicon

Abstract: A new low-temperature process that anneals out ion-implantation damage and activates the dopant in extremely shallow, implanted n+/p structures is presented. This technique employs low-energy (0.4 keV) H+ ion implantation following arsenic ion implantation and then a subsequent low-temperature (500–600 °C) furnace anneal. Very little dopant redistribution takes place with this new process and the device characteristics are comparable to other processes employing short-time, higher-temperature anneals.

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Cited by 25 publications
(9 citation statements)
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“…Thus, the improvement of S value at T A ¼ 400 and 500 1C was due to the change in the transport properties of the MnAs/Si junction. One possible origin is the interfacial modification through the activation of As atoms existing in the SOI layer [3,10]. The different junction properties also reflect the drain-source current (I DS )-the drain-source voltage (V DS ) characteristics in Fig.…”
Section: Magnetic Field (Koe)mentioning
confidence: 99%
“…Thus, the improvement of S value at T A ¼ 400 and 500 1C was due to the change in the transport properties of the MnAs/Si junction. One possible origin is the interfacial modification through the activation of As atoms existing in the SOI layer [3,10]. The different junction properties also reflect the drain-source current (I DS )-the drain-source voltage (V DS ) characteristics in Fig.…”
Section: Magnetic Field (Koe)mentioning
confidence: 99%
“…To such phenomena, we can relate: 1) suppressing the swirl defect creation under silicon growth in the hydrogen ambient [102]; 2) hydrogen-enhanced thermal donor creation in the hydrogen atmosphere or under hydrogen plasma treatment [103,104]; 3) enhanced annealing of radiation defects in hydrogenated crystalline silicon [105] and under RF plasma treatment [14]; 4) enhanced dopant activation under RF plasma effect [15] or additional hydrogen implantation with following thermal annealing [106,107]. A specific peculiarity of these phenomena is the lack of the restoration of defect properties after the following thermal annealing.…”
Section: Plasma Influence On Defects In the Subsurface Silicon Layermentioning
confidence: 99%
“…For example, the processes in which the electrically active defects (deep levels) are introduced are etching (chemical, reactive ion and sputter), annealing (laser and thermal), quenching, ion-implantation and irradiation with photons or particles with energies sufficient enough to cause atomic displacements. All such deep levels have been influenced on hydrogenation to show a hydrogen passivating effect (Pearton 1982;Singh et al 1984;Mu et al 1986a, b;Pearton et al 1992).…”
Section: Effect Of Hydrogen On Deep Levelsmentioning
confidence: 99%