2020
DOI: 10.1016/j.compositesb.2019.107690
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A low-dielectric decoration strategy to achieve absorption dominated electromagnetic shielding material

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Cited by 86 publications
(21 citation statements)
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“…The polymer resin provides interconnect bonding properties while conductive fillers conduct electricity in ECAs. This polymer is widely used because of its low density, high specific strength, dimensional stability, and chemical resistance [14][15][16][17][18].…”
Section: Introductionmentioning
confidence: 99%
“…The polymer resin provides interconnect bonding properties while conductive fillers conduct electricity in ECAs. This polymer is widely used because of its low density, high specific strength, dimensional stability, and chemical resistance [14][15][16][17][18].…”
Section: Introductionmentioning
confidence: 99%
“…Finally, the gel was calcined at 750 C for 360 min under an N 2 atmosphere to obtain the CF@CoFe 2 O 4 composite. [29][30][31]…”
Section: Sol-gel Methods For the Synthesis The Of Cf@cofe 2 O 4 Compositementioning
confidence: 99%
“…observations, as well as the EMI SE, EC and TC measurements, were described in our previous papers [24,29]. Additionally, the values of EMI SE, including total SE (SE T ), reflection SE (SE R ) and absorption SE (SE A ), were obtained from applying Equation (1)-(6) [26,41]:…”
Section: Characterizationsmentioning
confidence: 99%