A low cost wafer-level MEMS packaging technology

Monajemi, P.; Ayazi, Farrokh; Joseph, P. J. Amal; Kohl, Paul A.

doi:10.1109/memsys.2005.1454009

Cited by 19 publications

(12 citation statements)

References 11 publications

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“…Therefore, low cost batch-fabrication techniques that can provide a suspended impermeable seal on top of the micromechanical structures are of great interest. Several types of such techniques have been reported that are mostly based on wafer bonding [2][3][4] or removal of a sacrificial layer from the top of the devices after deposition of a sealing layer [5][6][7]. In general, packaging techniques based on wafer bonding add significant complexity and cost to the process and therefore thin-film sacrificial layer based techniques are preferred.…”

Section: Introductionmentioning

confidence: 99%

“…In general, packaging techniques based on wafer bonding add significant complexity and cost to the process and therefore thin-film sacrificial layer based techniques are preferred. Among interesting examples of such techniques are using thermally-decomposable polymers as sacrificial layer [6] and epitaxial growth of silicon on top of silicon structures patterned on SOI substrates for sealing and CMOS integration [7]. HARPSS (High Aspect Ratio Poly-and Single-crystal Silicon) fabrication process is a 3-D silicon bulk micromachining technology with superior capabilities in embedding high-performance electrostatic sensors and actuators in silicon substrate [8][9][10][11][12][13][14].…”

Section: Introductionmentioning

confidence: 99%

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Wafer-Level Encapsulation and Sealing of Electrostatic HARPSS Transducers

Pourkamali

Ayazi

2007

2007 IEEE Sensors

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This paper reports on a thin-film wafer-level encapsulation technique for packaging and CMOS integration of MEMS sensors and actuators fabricated through the HARPSS process. This approach takes advantage of the stationary parts of the micromechanical device itself for encapsulation of its sensitive moving parts, and therefore can be performed without addition of extensive processing steps. Encapsulated high frequency capacitive silicon resonators are demonstrated using this technique.Reliability and performance tests conducted on the encapsulated resonators reveal a high level of hermeticity and reliability with minimal interference with device operation. This technique can be applied to a wide variety MEMS sensors and actuators. Silicon transducers encapsulated using this approach can run through the regular IC fabrication and/or packaging processes.

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Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Wafer-Level Encapsulation and Sealing of Electrostatic HARPSS Transducers

Pourkamali

Ayazi

2007

2007 IEEE Sensors

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“…12.b shows the accelerometer, packaged by dispensing Unity and overcoating a 120im thick Avatrel overcoat. The static sensitivity of the packaged accelerometer is measured to be about 0.27pF/g [10]. The gold-Avatrel package was charactF Agilent 8517 vector network analyzer.…”

Section: Characterization Of the Packaged Harpss Varactorsmentioning

confidence: 99%

“…Our technique is based on thermal decomposition of a polymeric sacrificial material, Unity 2000 (Promerus, LLC) [9,10], through a spin-coated solid polymer overcoat, Avatrel (Promerus, LLC). The sacrificial material undergoes thermolytic degradation in an oven to create an air cavity on top of the active parts of the device.…”

Section: Introductionmentioning

confidence: 99%

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Characterization of A Polymer-Based MEMS Packaging Technique

Monajemi

Joseph

Kohl

et al.

2006 11th International Symposium on Advanced Packaging Materials: Processes, Properties and Interface

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This paper presents characterization of a low-cost polymer-based technique for wafer-level packaging of microelectromechanical systems (MEMS). The packaging process does not impose any size limitation to the device and can be applied to a wide variety of MEMS devices regardless of substrate type. Our technique utilizes thermal decomposition of a sacrificial polymer through a polymer overcoat cap, followed by metal deposition to create hermiticity. The method has been applied to surface and bulk micromachined silicon structures including resonators, tunable capacitors and accelerometers. Mechanical and electrical characterization of the packaged devices is reported to be very close to the corresponding values before packaging.

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Molding ceramic microstructures on flat and curved surfaces with and without embedded carbon nanotubes

Cannon

Allen

Graham

et al. 2006

J. Micromech. Microeng.

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This paper explores micromolding fabrication of alumina ceramic microstructures on flat and curved surfaces, the transfer of carbon nanotube (CNT) micropatterns into the ceramic and oxidation inhibition of these CNTs through ceramic encapsulation. Microstructured master mold templates were fabricated from etched silicon, thermally embossed sacrificial polymer and flexible polydimethylsiloxane (PDMS). The polymer templates were themselves made from silicon masters. Thus, once the master is produced, no further access to a microfabrication facility is required. Using the flexible PDMS molds, ceramic structures with mm scale curvature having microstructures on either the inside or the outside of the curved macrostructure were fabricated. It was possible to embed CNTs into the ceramic microstructures. To do this, micropatterned CNTs on silicon were transferred to ceramic via vacuum molding. Multilayered micropatterned CNT–ceramic devices were fabricated, and CNT electrical traces were encapsulated with ceramic to inhibit oxidation. During oxidation trials, encapsulated CNT traces showed an increase in resistance that was 62% less than those that were not encapsulated. The processes described here could allow fabrication of inexpensive 3D ceramic microstructures suitable for high temperature and harsh chemical environments.

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A low cost wafer-level MEMS packaging technology

Cited by 19 publications

References 11 publications

Wafer-Level Encapsulation and Sealing of Electrostatic HARPSS Transducers

Wafer-Level Encapsulation and Sealing of Electrostatic HARPSS Transducers

Characterization of A Polymer-Based MEMS Packaging Technique

Molding ceramic microstructures on flat and curved surfaces with and without embedded carbon nanotubes

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