Abstract:A low cost ball grid array package has been developed for use with flip chip die. The structural "back bone" of this chip carrier is a metal plate which serves as a built-in heat spreader and a floating ground plane as well as the principal structural member of the package.Thin film circuitry is employed to make the necessary connections between the die and the solder balls. The fine line circuitization enables escape of many I/O from the flip chip die and thus a high VO package with only a single layer of cir… Show more
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