2002
DOI: 10.1109/tmtt.2002.803446
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A low-cost fabrication technique for symmetrical and asymmetrical layer-by-layer photonic crystals at submillimeter-wave frequencies

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Cited by 41 publications
(29 citation statements)
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“…Several semiconductor fabrication approaches for THz components, including dicing saw machining [21], wet etching [22], deep reactive iron etching (DRIE) [23], deep X-ray lithography [24] and laser micromachining [20,24], have been reported. These methods are usually expensive, and require extraordinary care to achieve even relatively uniform THz EBG geometries, let alone the more complicated structures such as defect cavities and waveguides.…”
Section: Conventional Fabrication Methodsmentioning
confidence: 99%
See 1 more Smart Citation
“…Several semiconductor fabrication approaches for THz components, including dicing saw machining [21], wet etching [22], deep reactive iron etching (DRIE) [23], deep X-ray lithography [24] and laser micromachining [20,24], have been reported. These methods are usually expensive, and require extraordinary care to achieve even relatively uniform THz EBG geometries, let alone the more complicated structures such as defect cavities and waveguides.…”
Section: Conventional Fabrication Methodsmentioning
confidence: 99%
“…A 3D WPS designed based on the band diagram shown in Figure 2 is fabricated by the mechanical layer-by-layer dicing saw machining method [21]. The WPS dimensions are designed to be the following to achieve a band gap frequency of around 200 GHz: rod width w ¼ 176 lm, rod spacing d ¼ 646 lm and unit cell height D ¼ 704 lm [see Fig.…”
Section: Conventional Fabrication Methodsmentioning
confidence: 99%
“…To verify our design and the fabrication process, a silicon WPS with the aforementioned dimensions was fabricated using a simple but robust mechanical layer-by-layer dicing process [50], [51]. A series of grooves were cut into both the front and back faces of a silicon wafer (with a resistivity of Ohm-cm) by using a diamond dicing saw.…”
Section: Fabrication and Characterization Of The Silicon Wpsmentioning
confidence: 99%
“…Photonic crystals are fabricated by micromachining thin wafers of silicon, and piling them to form a layerby-layer structure. 25,26 Such a structure consists of a transverse stacking of arrays of dielectric rods with a facecentered-tetragonal lattice symmetry. 27,28 This type of crystal structure exhibits a very large photonic band gap.…”
Section: Samplesmentioning
confidence: 99%
“…27 The micromachining of our crystal was done with a programmable dicing saw, as described in more detail in Ref. 26: parallel grooves spaced by 185 m were diced on one side of a wafer with a thickness of 138± 3 m. The thickness of the grooves is 110 m and the depth one half of the thickness of the wafer, i.e., 69 m. Perpendicular grooves to these with the same thickness and depth were diced in the opposite side. This method produces a square grid of apertures.…”
Section: Samplesmentioning
confidence: 99%