2023
DOI: 10.1039/d2lc01159j
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A label-free electrochemical DNA biosensor used a printed circuit board gold electrode (PCBGE) to detect SARS-CoV-2 without amplification

Abstract: The emergence of coronavirus disease 2019 (COVID-19) motivates continuous efforts to develop robust and accurate diagnostic tests to detect the severe acute respiratory syndrome coronavirus-2 (SARS-CoV-2). Detection of viral nucleic...

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Cited by 9 publications
(4 citation statements)
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References 77 publications
(117 reference statements)
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“…65,71 ENIG uses a nickel layer on copper prior to gold deposition, while ENEPIG uses an intermediate palladium layer between nickel and gold to prevent long-term corrosion. 65,72 Hard gold plating offers a thicker layer of gold compared to ENIG to protect electrochemical chips from sliding wear, but ENIG plating offers more resistance to corrosion. 72,73 The thick layer of hard gold in high-wear areas of PCBs makes hard gold plating expensive.…”
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“…65,71 ENIG uses a nickel layer on copper prior to gold deposition, while ENEPIG uses an intermediate palladium layer between nickel and gold to prevent long-term corrosion. 65,72 Hard gold plating offers a thicker layer of gold compared to ENIG to protect electrochemical chips from sliding wear, but ENIG plating offers more resistance to corrosion. 72,73 The thick layer of hard gold in high-wear areas of PCBs makes hard gold plating expensive.…”
mentioning
confidence: 99%
“…65,72 Hard gold plating offers a thicker layer of gold compared to ENIG to protect electrochemical chips from sliding wear, but ENIG plating offers more resistance to corrosion. 72,73 The thick layer of hard gold in high-wear areas of PCBs makes hard gold plating expensive. 67 Therefore, the most commonly used method for fabricating electrochemical chips is ENIG.…”
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confidence: 99%
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