“…67 Therefore, the most commonly used method for fabricating electrochemical chips is ENIG. 65,72,73 Immersion silver is directly electroplated from the electrolyte solution onto the copper layer, and lacks a nickel layer, making it weaker than immersion gold and requiring more care for long-term storage. 68 Industrial plating processes that use ENIG, ENEPIG, and hard gold introduce organic and inorganic impurities such as watersoluble and rosin-based flux residues, 74 copper traces, 75 and in rare cases, nickel 76 on electrodes, which could interfere with functionalization and consequently, the electroanalytical performance of biosensors manufactured using PCB technology.…”