A Hybrid Active Neutral Point Clamped Converter consisting of Si IGBTs and GaN HEMTs for Auxiliary Systems of Electric Aircraft

Fauth, Leon; Beckemeier, Christian; Friebe, Jens

doi:10.1109/ecce47101.2021.9595512

Cited by 1 publication

(2 citation statements)

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“…For example, ref. [18] uses GaN HEMTs for positions T2 and T3 since they can achieve high switching frequencies due to their low output capacitances. The challenge of the limited current carrying capability of state-of-the-art GaN switches is overcome by interleaving respective switches.…”

Section: Design Packaging and Thermal Aspectsmentioning

confidence: 99%

“…To overcome the inherent limitations of this topology, innovative control strategies and sophisticated hardware designs are required. To take advantage of GaN semiconductors by using these devices in combination with a high voltage level count [15][16][17] and in combination with interleaving to increase the power rating [18], this topology can be applicable.…”

Section: Introductionmentioning

confidence: 99%

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Review, Comprehensive Analysis and Derivation of Analytical Power Loss Calculation Equations for Two- to Three-Level Midpoint Clamped Inverter Topologies with Hybrid Switch Configurations

Radomsky,

Mallwitz

2023

Energies

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Increased performance requirements in new power electronics areas of application, such as electric aircraft, make innovations on different design levels necessary. In order to quickly compare different topologies, analytical loss equations provide a fast and straightforward way to narrow down the possible solution space. The approach widely used in the literature results in long and complex terms, which can only be compared between different literature sources with great effort. Moreover, the literature lacks a detailed summarizing description of these analytical equations and their derivation, starting from the standard two-level VSI up to three-level midpoint clamped inverter topologies, such as the ANPC topology in its different modulation schemes. The application of such higher-level inverter topologies allows hybrid device configurations to become performant solutions. This work aims to give a closed-form description of the analytical loss modeling and the theoretical background and provide an implementation approach for a wide span of inverter topologies and for different modulation methods.

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Section: Design Packaging and Thermal Aspectsmentioning

confidence: 99%