A Highly Reliable Design for a Nonmetallurgical Contact-Joint Structure Consisting of an Adhesive Film

Tanaka, Nobuatsu; Kawano, Kenya; Miura, Hideo; Kado, Yoshiyuki; Yoshida, Ikuo

doi:10.1115/1.1648059

Cited by 18 publications

(4 citation statements)

References 2 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…Teo et al (2003Teo et al ( , 2005 carried out enhanced moisture sensitivity testing (MST), temperature cycling (TC), high temperature storage (HTS) and pressure cooker testing (PCT) and concluded that the best properties of an ACF for high reliability assemblies included high adhesive strength after being subjected to reliability test conditions, low coefficient of moisture expansion (CME) and low elastic modulus (E). Tanaka et al (2004) investigated the effects of an ACF's material properties and build-up substrate on the interconnection reliability of ACF joints during temperature cycling tests. The results showed that the plastic strain of a bump and pad decreased for ACF joints with an ACF of low CTE and a build-up material with a low Young's modulus, which could improve the interconnection reliability of the ACF joints.…”

Section: Mechanical Characterization Of Bonding Assemblies With Diffementioning

confidence: 99%

Recent advances in mechanical properties of anisotropic conductive adhesive film for microelectronic packaging

Gao

Chen

2015

Soldering &Amp; Surface Mount Technology

View full text Add to dashboard Cite

Purpose -This review paper aims to provide a better understanding of formulation and processing of anisotropic conductive adhesive film (ACF) material and to summarize the significant research and development work for the mechanical properties of ACF material and joints, which helps to the development and application of ACF joints with better reliability in microelectronic packaging systems. Design/methodology/approach -The ACF material was cured at high temperature of 190°C, and the cured ACF was tested by conducting the tensile experiments with uniaxial and cyclic loads. The ACF joint was obtained with process of pre-bonding and final bonding. The impact tests and shear tests of ACF joints were completed with different aging conditions such as high temperature, thermal cycling and hygrothermal aging. Findings -The cured ACF exhibited unique time-, temperature-and loading rate-dependent behaviors and a strong memory of loading history. Prior stress cycling with higher mean stress or stress amplitude restrained the ratcheting strain in subsequent cycling with lower mean stress or stress amplitude. The impact strength and adhesive strength of ACF joints increased with increase of bonding temperature, but they decreased with increase of environment temperature. The adhesive strength and life of ACF joints decreased with hygrothermal aging, whereas increased firstly and then decreased with thermal cycling. Originality/value -This study is to review the recent investigations on the mechanical properties of ACF material and joints in microelectronic packaging applications.

show abstract

Section: Mechanical Characterization Of Bonding Assemblies With Diffementioning

confidence: 99%

Recent advances in mechanical properties of anisotropic conductive adhesive film for microelectronic packaging

Gao

Chen

2015

Soldering &Amp; Surface Mount Technology

View full text Add to dashboard Cite

show abstract

“…In this structure, the number of I/O pins can be drastically increased because the area-arrayed micro bumps are formed on the whole area of a Si chip surface. However, the complexity of the structure and the difficulty of assembly process must cause low yield of mass production [2]- [5]. Therefore, the reduction of the production cost is indispensable for realizing such 3D-stacked structures.…”

Section: Introductionmentioning

confidence: 99%

Effect of the mechanical properties of underfill on the local deformation and residual stress in a chip mounted by area-arrayed flip chip structures

Nakahira

Sato

Kishi

et al. 2010

2010 11th International Thermal, Mechanical &Amp; Multi-Physics Simulation, and Experiments in Microelectronics and Microsystem

Self Cite

View full text Add to dashboard Cite

Since the thickness of the stacked silicon chips in 3D integration has been thinned to less than 100 urn, the local thermal deformation of the chips has increased drastically because of the decrease of the flexural rigidity of the thinned chips. The clear periodic thermal deformation and thus, the thermal residual stress distribution appear in the stacked chips due to the periodic alignment of metallic bumps, and they deteriorate the reliability of products. In this paper, the dominant structural factors of the local deformation of a silicon chip are discussed quantitatively based on the results of a three-dimensional fmite element analysis and the measurement of the local deformation and residual stress in a chip using strain sensor chips and interference microscopy.

show abstract

“…In this structure, the number of I/O pins can be drastically increased because of area-arrayed micro bumps formed on whole area of Si chip surface. However, the complexity of the structure and the difficulty of assembly process must cause low yield of mass production [2]- [5]. Therefore, the reduction of the production cost is indispensable for realizing such 3Dstacked structures.…”

Section: Introductionmentioning

confidence: 99%

A nondestructive evaluation system for detecting open failures of micro bump interconnections in 3D-stacked structures

Sato

Miura

2007

2007 International Conference on Electronic Materials and Packaging

View full text Add to dashboard Cite

A nondestructive evaluation system for detecting delamination between a chip and micro bumps in 3D-stacked structures is indispensable for highly reliable and low-cost manufacturing. In stacked structures, it is hard to inspect the adhesion condition of metallic bumps that connect a lower chip with an upper chip because most of the bumps are invisible. We have, therefore, proposed a new nondestructive evaluation method for detecting delamination between a chip and metallic bumps by measuring the local surface deformation of the chip. We have already validated that the local deformation of thinned chips significantly increases when the defects such as a lack and delamination of bumps occur. In this research, the theoretical limit of the minimum detectable gap of the delamination was analyzed using a finite element method. It was found that 1 m-thick delamination can be detected. In addition, to improve the accuracy of this evaluation method, noise factors that affect the amplitude of the local surface deformation of a chip were discussed and the noise reduction algorithm was proposed based on the analytical results. For example, the effect of the fluctuation of bump height can be eliminated by analyzing the difference of local deformation between before and after underfill filling. In order to validate the effectiveness of this inspection method for detecting open failures in 3D-stacked structures, we made test area-arrayed 3D-stacked chips and measured the local deformation at a surface of the test chips. It was confirmed that the defects of the bump interconnections could be detected precisely by measuring the change of the amplitude in 3D-stacked structures. Therefore, we concluded that a nondestructive evaluation system for micro bump interconnections in 3D-stacked structures has been established successfully.

show abstract

A Highly Reliable Design for a Nonmetallurgical Contact-Joint Structure Consisting of an Adhesive Film

Cited by 18 publications

References 2 publications

Recent advances in mechanical properties of anisotropic conductive adhesive film for microelectronic packaging

Recent advances in mechanical properties of anisotropic conductive adhesive film for microelectronic packaging

Effect of the mechanical properties of underfill on the local deformation and residual stress in a chip mounted by area-arrayed flip chip structures

A nondestructive evaluation system for detecting open failures of micro bump interconnections in 3D-stacked structures

Contact Info

Product

Resources

About