A Highly-Reliable and Cost-Effective Approach by Reducing Flux Cleaning in Flip-Chip Processes Through Underfill Curing in a Pneumatic Ambient

Su, Huan-Ping; Hsu, Ming-Hua; Horng, Chih-Horng

doi:10.1109/ectc51529.2024.00333

2024 IEEE 74th Electronic Components and Technology Conference (ECTC) 2024

DOI: 10.1109/ectc51529.2024.00333

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A Highly-Reliable and Cost-Effective Approach by Reducing Flux Cleaning in Flip-Chip Processes Through Underfill Curing in a Pneumatic Ambient

Huan-Ping Su,

Ming-Hua Hsu,

Chih-Horng Horng

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A Highly-Reliable and Cost-Effective Approach by Reducing Flux Cleaning in Flip-Chip Processes Through Underfill Curing in a Pneumatic Ambient

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