Digest. International Electron Devices Meeting,
DOI: 10.1109/iedm.2002.1175867
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A highly manufacturable high density embedded SRAM technology for 90 nm CMOS

Abstract: A highly manufacturable high density embedded SRAM technology with 0.8um2 cell for 90nm technology node has been developed. Based on cell layout study by lithography simulation, both cell layout and key process were carefully optimized and scaled down from those of lOOnm technology. Fabricated SRAM used 0.25um well isolation and O.lum contact showed good functionality down to VDP0.6V. Electrical fuse utilizing MOSFET was also developed for redundancy to avoid Cu/Low-k BEOL damage from laser blow.

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“…The cell employs wide bit topology for better cell device mismatch properties [5][6]. The layout of the bitcell is shown in Figure 2.…”
Section: Drowsy Back-bias Schemementioning
confidence: 99%
“…The cell employs wide bit topology for better cell device mismatch properties [5][6]. The layout of the bitcell is shown in Figure 2.…”
Section: Drowsy Back-bias Schemementioning
confidence: 99%