2023
DOI: 10.1109/led.2023.3268334
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A Highly Linear Temperature Sensor Operating up to 600°C in a 4H-SiC CMOS Technology

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Cited by 16 publications
(3 citation statements)
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“…reduced by up to ∼50% [6]. In spite of the significant benefit to the power system with SiC MOSFETs, there exists a tradeoff between R on and BV of the conventional planar gate vertical SiC MOSFETs (CON-MOS), which is indicated by Baliga figure of merit (BFOM = 4BV 2 /R on,sp ) [7][8][9][10]. R on is dominated by the epitaxial layer resistance and JFET component (R JFET ) at higher voltages due to higher resistivity or lower background carrier concentration in the epitaxial layer [8][9][10][11].…”
Section: Introductionmentioning
confidence: 99%
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“…reduced by up to ∼50% [6]. In spite of the significant benefit to the power system with SiC MOSFETs, there exists a tradeoff between R on and BV of the conventional planar gate vertical SiC MOSFETs (CON-MOS), which is indicated by Baliga figure of merit (BFOM = 4BV 2 /R on,sp ) [7][8][9][10]. R on is dominated by the epitaxial layer resistance and JFET component (R JFET ) at higher voltages due to higher resistivity or lower background carrier concentration in the epitaxial layer [8][9][10][11].…”
Section: Introductionmentioning
confidence: 99%
“…In spite of the significant benefit to the power system with SiC MOSFETs, there exists a tradeoff between R on and BV of the conventional planar gate vertical SiC MOSFETs (CON-MOS), which is indicated by Baliga figure of merit (BFOM = 4BV 2 /R on,sp ) [7][8][9][10]. R on is dominated by the epitaxial layer resistance and JFET component (R JFET ) at higher voltages due to higher resistivity or lower background carrier concentration in the epitaxial layer [8][9][10][11]. In addition, the minimization of the reverse transfer capacitance (C rss or C GD ) and gate-to-drain charge (Q GD ) of the devices is essential for improving high frequency performance because they are dominant factors that determine switching energy loss [12].…”
Section: Introductionmentioning
confidence: 99%
“…All the 4H-SiC-based proposed temperature sensors transduce temperature in electrical quantities, either through the difference of Gate Source Voltages ( ) between two MOSFETs [ 11 ], or through the difference of diode forward voltages [ 2 , 3 , 9 , 13 , 14 ]. However, 4H-SiC diodes with good performances have vertical structures and they are incompatible with VLSI circuits, whereas, although MOSFETs can be used, they need an integrated circuit in order to read out the voltage-temperature signal.…”
Section: Introductionmentioning
confidence: 99%